Metals Deposition Development Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 134,000 - 189,000; Full time

Job summary

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development organization to accelerate development of advanced process development for high-k/metal gate, contact, and interconnect.

You will own metals process definition, development, and optimization across ALD, CVD, PVD, electrochemical deposition, and related platforms, supporting rapid yield improvement and manufacturability.

Qualifications

• PhD in a STEM field as listed above.

Responsibilities

• Own thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related platforms.

Skills

Thin film deposition technologies

Statistical data analysis

Experimental design

Cross-functional collaboration

On-site availability

Education

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

Tools

XRF

XPS

XRD

SEM

TEM

ellipsometry

e-test

defect inspection

reliability

JMP

Excel

Python

R

SQL

Job description

Intel Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development organization to accelerate development of advanced process development for high-k/metal gate, contact, and interconnect.

You will own metals process definition, development, and optimization across ALD, CVD, PVD, electrochemical deposition, and related platforms, supporting rapid yield improvement and manufacturability.