Thin Films Module Development Engineer

Talanto

Hillsboro (OR)

Hybrid

USD 134,000 - 189,000

Full time

5 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.

Core Responsibilities include ownership of deposition technology, experimental design, and process

Qualifications

  • PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or closely related STEM field.
  • At least 1 year of experience with thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, or electrochemical deposition.
  • Ability to analyze process data using statistics, troubleshoot, and design robust experiments.

Responsibilities

  • Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related platforms.
  • Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control.
  • Design, execute, and analyze experiments to meet device requirements and support rapid yield improvement.
  • Apply expert knowledge of equipment operating principles and materials metrology methods.

Skills

ALD
CVD
PVD
Sputtering
Evaporation
Electrochemical deposition
Data analysis
Python
R
SQL
Statistical methods
Troubleshooting
Communication
Collaboration

Education

PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

Tools

XRF
XPS
XRD
SEM
TEM
Ellipsometry
e-test
Defect inspection

Job description

Important: if an employer asks you to log into their system via iCloud or Google, send a code, an SMS or Telegram password, run some code, or install software — refuse. These are signs of fraud.

Job Description:

••••• Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:

  • Primary ownership of thin film metal deposition process development across ALD, CVD, PVD, electrochemical deposition, and related process platforms
  • Design, implement, and optimize processes to meet specifications for materials, device performance, yield, and process control
  • Design, execute, and analyze experiments to meet integrated device requirements and support rapid yield improvement
  • Apply expert knowledge of equipment operating principles, materials characteri...

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

  • PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

With at least 1+ years of experience in:

  • Working knowledge of one or more thin film deposition technologies such as ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, or related vacuum process technologies
  • Demonstrated ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design

Preferred Qualifications:

  • Experience in thin film metal deposition process development for high-k/metal gate stack, contact metallization, or Cu interconnect barrier/liner/plating
  • Experience with materials characterization and metrology methods such as XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test, defect inspection, reliability, and related techniques
  • Experience with MOSFET / FinFET / GAA / CFET device characteristics, electrical characterization techniques, and semiconductor device fundamentals
  • Proficient with data analysis software including JMP, Excel, Python, R, SQL
  • Strong communication and collaboration skills with demonstrated ability to solve challenging and ambiguous technical problems in a fast-moving and dynamic team environment
  • Experience using AI-assisted engineering tools to improve technical productivity while maintaining critical independent engineering judgement
  • Strong written and verbal communication skills with ability to document decisions, summarize technical data, and align cross-functional stakeholders
  • Availability to work on site and support 24/7 manufacturing operations with on-call rotation

Job Details:

••••• Foundry is seeking highly motivated Thin Films Metals Module Development Engineers to join the Technology Development (TD) organization to accelerate development of advanced process development for applications in high-k/metal gate, contact, and interconnect. In this role you will be responsible for delivering metals process definition, development, and optimization in metal deposition modules.
Core Responsibilities:

    ...

Qualifications:

Minimum qualifications ...

Minimum Qualifications:

  • PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field

With at least 1+ years of experience in:

  • Working knowledge ...
  • Demonstrated ability ...

Preferred Qualifications:

    ...

For information on ’s immigration sponsorship guidelines, please see U.S. Immigration Sponsorship Information

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

The range shows the lower and upper market bands: 25% of vacancies pay below the first value, the median is the typical salary, and 75% marks the upper band.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Thin Films Module Development Engineer
Thin Films Module Development Engineer

Intel • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Competitive pay
Stock bonuses
Health benefits
Thin Films Module Development Engineer
Thin Films Module Development Engineer

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Senior Member of Technical Staff, Thin Films Engineer
Senior Member of Technical Staff, Thin Films Engineer

Intel • Hillsboro (OR)

Hybrid
USD 155,000 - 299,000
Health benefits
Retirement plans
Vacation
Senior Member of Technical Staff, Thin Films Engineer
Senior Member of Technical Staff, Thin Films Engineer

Intel • Phoenix (AZ)

Hybrid
USD 155,000 - 299,000
Competitive pay
Stock bonuses
Health benefits
+1
Module Development Engineer
Module Development Engineer

Intel • Hillsboro (OR)

On-site
USD 133,800 - 188,890
Innovative Thin Films Module Engineer (ALD/CVD/PVD)
Innovative Thin Films Module Engineer (ALD/CVD/PVD)

Intel • Hillsboro (OR)

On-site
USD 134,000 - 189,000
Competitive pay
Stock bonuses
Health benefits
Sr. Thin Film Manufacturing Engineer (52367)
Sr. Thin Film Manufacturing Engineer (52367)

Headway Technologies • Milpitas (CA)

On-site
USD 142,000 - 201,000
Senior Process Integration Development Engineer
Senior Process Integration Development Engineer

Talanto • Phoenix (AZ)

Hybrid
USD 134,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Technology Development Foundry Engineering – Senior Staff Engineer
Technology Development Foundry Engineering – Senior Staff Engineer

Intel • Hillsboro (OR)

Hybrid
USD 156,000 - 255,000
Technology Development Foundry Engineering – Senior Staff Engineer
Technology Development Foundry Engineering – Senior Staff Engineer

Intel • Albuquerque (NM)

Hybrid
USD 156,000 - 255,000