Mechanical Hardware Development Engineer

LCS Defense; Jessup (MD); On-site; USD 120,000 - 180,000; Full time

Job summary

LCS Defense is seeking a Mechanical Hardware Development Engineer to lead mechanical design and electronics packaging for high-speed networking devices. This role covers the full development lifecycle from concept to manufacturing handoff, integrating mechanical design, thermal analysis, and electronics packaging with electrical, hardware, and test engineering teams.

The position involves collaboration across multiple sites including Jessup, MD and other U.S.

Qualifications

• Active TS/SCI clearance with Full-Scope Polygraph.
• 5+ years of relevant mechanical engineering experience.

Responsibilities

• Design mechanical enclosures, chassis, and electronics packaging for high-speed networking hardware from concept to manufacturing handoff.
• Create and maintain SolidWorks CAD models, drawings, GD&T, and mechanical documentation packages.
• Perform thermal, CFD, and FEA analyses using Ansys to meet performance, reliability, and environmental requirements.

Skills

SolidWorks

GD&T

Electronics Packaging

Thermal Analysis

Cross-functional teamwork

Engineering documentation

Mechanical design

Rapid prototyping

Agile / Scrum

Tools

Ansys

CFD

Job description

Mechanical Hardware Development Engineer

Mechanical Hardware Development Engineer

Company: LCS Defense

Clearance: Active TS/SCI with Full-Scope Polygraph required

Experience: 5+ years of relevant mechanical engineering experience

Location: Jessup, MD; Arlington, VA; Herndon, VA OR Denver, CO

Position Overview

LCS Defense is seeking a Mechanical Hardware Development Engineer to lead mechanical design and electronics packaging for high-speed networking devices.

The engineer will support the full development lifecycle, from concept and prototyping through validation and manufacturing handoff. This role combines mechanical design, thermal analysis, electronics packaging, and collaboration with electrical, hardware, and test engineering teams.

Key Responsibilities

• Design mechanical enclosures, chassis, and electronics packaging for high-speed networking hardware, from initial concept through prototype development and manufacturing handoff.
• Create and maintain SolidWorks CAD models, detailed drawings, geometric dimensioning and tolerancing (GD&T), and complete mechanical technical documentation packages (TDPs).
• Perform thermal, computational fluid dynamics (CFD), and mechanical finite element analysis (FEA) using Ansys to validate performance, reliability, and environmental requirements, including applicable ASHRAE and MIL-STD-810 requirements.
• Address datacenter and server hardware constraints, including rack and chassis integration, airflow, thermal management, PCB integration, connector and cable routing, and serviceability.
• Incorporate EMI/EMC shielding, ruggedization, and environmental sealing into electronics packaging for government and secure operating environments.
• Collaborate with electrical, PCB, FPGA, hardware, and test engineers to meet electrical, thermal, and form-factor requirements.
• Coordinate with machine shops, fabrication contractors, and contract manufacturers, including managing component and material procurement risks and manufacturing transitions.
• Develop fixtures and mechanical test setups to support prototype bring-up and validation.
• Refine designs based on simulation, testing, and prototype performance.
• Support hardware/software co-development and government certification activities within a small, cross-functional team.

Required Qualifications

• Active TS/SCI clearance with Full-Scope Polygraph.
• At least 5 years of relevant experience in mechanical, aerospace, or equivalent engineering.
• Experience designing mechanical enclosures, chassis, and electronics packaging through the full product development lifecycle.
• Proficiency in SolidWorks, detailed engineering drawings, GD&T, and mechanical documentation packages.
• Experience using Ansys for thermal/CFD and mechanical/FEA analysis.
• Knowledge of rack and chassis integration, airflow and thermal management, PCB mechanical integration, cable routing, and serviceability.
• Experience addressing EMI/EMC shielding, ruggedization, and environmental sealing requirements.
• Experience coordinating with external fabrication vendors and supporting manufacturing handoffs.
• Experience supporting prototype development, mechanical testing, and design iteration.
• Familiarity with hardware/software co-development and government certification processes.
• Ability to work effectively in an agile, cross-functional engineering environment.

Preferred Qualifications

• Experience designing electronics packaging, server hardware, or datacenter hardware.