Sr. Mechanical Engineer (EMI Shielding)

TECHEAD; United States; À distance; USD 120 000 - 180 000; Plein temps

Résumé du poste

TECHEAD is seeking a Senior Mechanical Engineer to lead the design, verification, and sustainment of ruggedized electronic enclosures and mission-critical hardware in a fully remote role.

You will own the mechanical hardware lifecycle from concept through qualification, coordinating with Electrical, Systems, PCB, and Manufacturing Engineering to ensure EMI/EMC, thermal, and manufacturability requirements are met for high-reliability defense platforms.

Qualifications

• Bachelor’s degree in Mechanical Engineering or related field.
• 7–10+ years of mechanical engineering experience focused on electronic packaging and enclosures.
• Experience with ruggedized electronics for defense/aerospace per military/aerospace standards.
• Proficient in 3D CAD and PLM/PDm tools.
• Strong EMI/EMC shielding, environmental sealing, and thermal management expertise.
• Experience with MIL-STD-810/461 or RTCA/DO-160.

Responsabilités

• Act as the lead mechanical authority for mission-critical electronic hardware deployed in defense, aerospace, and high-security settings.
• Manage enclosure and platform architecture from initial requirement definition through volume manufacturing.
• Design precision sheet metal and CNC-machined structures for TEMPEST, EMI/EMC, and shielding.
• Coordinate mechanical participation in environmental stress and qualification testing.
• Lead hands-on prototype integration, bench testing, and fit checks.
• Provide sustaining engineering support and manage ECOs and product upgrades.

Connaissances

Mechanical design

Electronic packaging

Thermal management

EMI/EMC shielding

3D CAD (SolidWorks)

DFM/DFA

MIL-STD-810 / MIL-STD-461

PLM tools

Leadership

Formation

Bachelor’s degree in Mechanical Engineering

Outils

SolidWorks

PLM software

Description du poste

This position is fully remote / work from home.

A prominent defense and secure communications manufacturer is seeking an experienced Senior Mechanical Engineer to lead the design, verification, and sustainment of ruggedized electronic enclosures and mission-critical hardware platforms. In this position, you will serve as the mechanical design authority—owning full-lifecycle hardware development for high-reliability systems deployed in harsh and security-sensitive operating environments.

You will collaborate closely with cross-functional teams across Electrical, Systems, PCB, and Manufacturing Engineering to deliver robust enclosures optimized for thermal dissipation, structural integrity, electromagnetic compatibility, and strict manufacturability requirements.

Key Responsibilities

• Act as the lead mechanical authority for mission-critical electronic hardware deployed in defense, aerospace, and high-security settings.
• Manage enclosure and platform architecture from initial requirement definition through volume manufacturing, covering:
• Custom chassis, frame assemblies, and COTS component integration.
• Thermal management systems (passive conduction, forced convection, liquid cooling, and heat sinks).
• Structural resilience against high shock, random vibration, temperature extremes, moisture ingress, dust, and corrosive salt-fog environments.
• Translate electrical and payload constraints into scalable, low-to-high volume manufacturable hardware solutions.
• Design precision sheet metal and CNC-machined structures that support TEMPEST, low-emissions, and strict EMI/EMC attenuation strategies:
• Radio frequency (RF) shielded housings, access covers, and conductive seams.
• Specialized EMI gasketing, bonding, and grounding paths.
• Secure cable egress/ingress zones, connector isolation, and shielding barriers.
• Coordinate with electrical and layout teams to align chassis geometry with PCB layout strategies for optimal electromagnetic mitigation and signal isolation.
• Support strict physical signal separation (e.g., RED/BLACK architectures) through internal mechanical compartmentalization.
• Generate complex 3D CAD models, sub-assemblies, and production-ready drawing packages utilizing ASME Y14.5 drafting standards.
• Perform detailed tolerance stack-up analyses and apply Geometric Dimensioning & Tolerancing (GD&T).
• Conduct structural and thermal Finite Element Analysis (FEA) to validate mechanical integrity prior to prototyping.
• Select compliant surface finishes, specialized materials, and hardware retention strategies suitable for long-lifecycle deployment.
• Lead hands-on prototype integration, bench testing, and fit checks.
• Coordinate mechanical participation in environmental stress and qualification testing (thermal cycling, shock, vibration, ingress protection, EMI/EMC).
• Define physical layout parameters for critical PCB components, including connector locations, high-dissipation ICs, and thermal interface materials (TIMs).
• Partner with PCB layout engineers on grounding topologies, component clearances, and thermal relief strategies.
• Work alongside manufacturing teams to incorporate Design for Manufacturability/Assembly (DFM/DFA) principles, tooling considerations, and assembly streamlining.
• Support supply chain teams on component sourcing, alternate material qualifications, and component obsolescence management.
• Defend mechanical trade studies, risk assessments, and architectural choices during formal design reviews.
• Author standard operating procedures, assembly documentation, and manufacturing test fixtures for production handoff.
• Provide sustaining engineering support for deployed hardware, addressing field returns, engineering change orders (ECOs), and product upgrades.
• Maintain rigorous configuration control and document management across the product lifecycle.

Qualifications & Requirements

• Bachelor’s degree in Mechanical Engineering or a related discipline.
• 7–10+ years of professional mechanical engineering experience, with a focus on electronic packaging and enclosure design.
• Direct experience developing ruggedized electronics and chassis assemblies for defense or aerospace applications in accordance with applicable military/aerospace standards.
• Solid technical background in:
• Board-level and system-level thermal management.
• Mechanical design strategies for EMI/EMC shielding and environmental sealing.
• Hands-on proficiency with modern 3D CAD software (SolidWorks preferred) and product data management / PLM tools.
• Proven track record leading mechanical hardware platforms through the full lifecycle—from concept design to qualification and long-term sustainment.
• Experience designing to aerospace and defense specifications (e.g., MIL-STD-810, MIL-STD-461, RTCA/DO-160, or equivalent).
• Hands-on background conducting EMI/EMC mechanical mitigation and participating in lab compliance testing.
• Experience designing ruggedized systems subjected to extreme dynamic shock, vibration, and environmental exposure.