Hardware Engineering Intern: GPU/CPU & SoC Innovation

Qualcomm

Santa Clara (CA)

On-site

USD 33,000 - 39,000

Full time

14 days+

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Qualcomm Technologies, Inc. offers a Hardware Engineering Internship across several tracks, including GPU, CPU, DV, and SoC Systems. Interns will apply electrical or computer engineering knowledge to multi-disciplinary teams, tackling architecture, RTL, verification, and post-silicon validation tasks.

The program emphasizes hands-on learning, mentorship, and real-world impact. Students gain exposure to AI, high-performance computing, and state-of-the-art connectivity in a global setting.

Qualifications

  • Must be pursuing Electrical or Computer Engineering degree.
  • Strong programming fundamentals and willingness to learn HW design concepts.
  • Familiarity with HDL/verification concepts is a plus.

Responsibilities

  • Eng design and development in MSM SOC and chipset architecture.
  • ASIC implementation of image processing camera IP.
  • GPU pipeline validation and driver/model checks.
  • Power/thermal considerations and performance analyses.

Skills

C
C++
Verilog
SystemVerilog
Python
Perl

Job description

Qualcomm Technologies, Inc. offers a Hardware Engineering Internship across several tracks, including GPU, CPU, DV, and SoC Systems. Interns will apply electrical or computer engineering knowledge to multi-disciplinary teams, tackling architecture, RTL, verification, and post-silicon validation tasks.

The program emphasizes hands-on learning, mentorship, and real-world impact. Students gain exposure to AI, high-performance computing, and state-of-the-art connectivity in a global setting.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Hardware Engineering Intern: GPUs, CPU & SoC Systems
Hardware Engineering Intern: GPUs, CPU & SoC Systems

QUALCOMM, Inc. • Austin (TX)

On-site
USD 27,000 - 38,000
Hardware Engineering Intern: GPU/CPU & SoC Design
Hardware Engineering Intern: GPU/CPU & SoC Design

QUALCOMM, Inc. • Tempe (AZ)

On-site
USD 28,000 - 36,000
Hardware Engineering Intern — GPU/CPU & SoC Systems
Hardware Engineering Intern — GPU/CPU & SoC Systems

QUALCOMM, Inc. • Boxborough (MA)

On-site
USD 28,000 - 41,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

QUALCOMM, Inc. • Tempe (AZ)

On-site
USD 28,000 - 36,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

QUALCOMM, Inc. • Boxborough (MA)

On-site
USD 28,000 - 41,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

QUALCOMM, Inc. • Austin (TX)

On-site
USD 27,000 - 38,000
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

QUALCOMM, Inc. • Santa Clara (CA)

On-site
USD 33,000 - 39,000
Hardware Engineering Intern: Relocation & Housing Covered
Hardware Engineering Intern: Relocation & Housing Covered

Qualcomm • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Relocation and housing for internship
Multimedia Engineering Intern: AI, Vision & GPU
Multimedia Engineering Intern: AI, Vision & GPU

QUALCOMM, Inc. • Santa Clara (CA)

On-site
USD 23,000 - 135,000
Relocation covered
Housing provided
Competitive hourly pay
+1
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027
Hardware (CPU, GPU, SoC, Digital Design, DV) Engineering Internship – Summer 2027

Qualcomm • San Diego (CA)

On-site
USD 23,000 - 135,000
Relocation coverage
Furnished housing
Relocation and housing for internship