Materials Engineer-Advanced Deposition Technology-at Gelest

Gelest Inc.; United States; On-site; USD 70,000 - 100,000; Full time

Job summary

Gelest Inc., part of the Mitsubishi Chemical Group, is seeking a Materials Engineer in Advanced Deposition Technology to support innovation in specialty materials. This position involves wafer coating, thin-film deposition, and lithography process development within a collaborative environment.

Ideal candidates will have a solid background in materials science and strong laboratory skills, ensuring high reproducibility in nanometer-scale environments while working on cutting-edge semiconductor applications.

Qualifications

• Strong experimental skills in wafer coating and thin-film deposition techniques.
• Ability to work with microelectronics and advanced materials applications.
• Experience in characterizing materials and conducting lithography process development.

Responsibilities

• Support development of advanced thin-film materials in a COE.
• Collaborate with scientists and engineers in research initiatives.
• Maintain reproducibility in nanometer-scale film deposition.

Skills

Wafer coating

Thin-film deposition

Lithography process development

Materials characterization

Laboratory discipline

Attention to detail

Education

Degree in Materials Science or related field

Job description

Company: Gelest Inc.

Job Description: Gelest, Inc., part of the Mitsubishi Chemical Group, is hiring a Materials Engineer‑Advanced Deposition Technology to support our continued growth in specialty materials. Join a collaborative team where your expertise will help advance technologies that impact industries around the globe.

The Materials Engineer – Advanced Deposition Technology is responsible for supporting the development, optimization, and characterization of advanced thin‑film and lithographic materials within the Advanced Deposition Technology Center of Excellence (COE). This role supports incubation‑stage research initiatives focused on emerging semiconductor, microelectronics, and advanced materials applications aligned with the organization’s long‑term innovation strategy.

The position will perform wafer coating, thin‑film deposition, lithography process development, and materials characterization activities while collaborating closely with scientists, engineers, and cross‑functional technical teams. The role requires strong laboratory discipline, attention to detail, and the ability to maintain high reproducibility in nanometer‑scale film deposition and processing environments.