Material Analysis Lab Tech: Nanometer Imaging & QC

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 60,000 - 85,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Corporation in Hillsboro, OR, is seeking a Materials Analysis Technician to perform material and failure analysis in support of silicon process development and high-volume manufacturing. You will help develop imaging, composition analysis, and sample prep techniques and share BKMs to improve lab output.

The role interfaces with TD and HVM customers, reliability engineers, and cross-functional teams to solve problems using SEM/EDX, FIB, TEM, and other characterization tools.

Qualifications

• Bachelor’s degree in Material Science or STEM related to semiconductor manufacturing with 2+ years maintenance experience.
• Associate degree STEM related to semi. mfg with 4+ years maintenance experience.
• Experience with lab techniques and semiconductor processes is preferred.

Responsibilities

• Conduct hands-on analysis using lab techniques from sample prep to SEM/EDX and FIB to characterize silicon structures.
• Collect data with lab equipment and assist engineers in applying material characterization techniques for process improvement.
• Support and sustain lab equipment to ensure capabilities for advanced transistor and interconnect tech and product ramp.
• Develop new tools and BKMs; provide lab hub support for ramp in HVM factories and production startup.

Skills

Maintenance experience

AFM

XRF/XRD

XPS

SEM/TEM/EDX

FIB techniques

Ion mill etcher

Education

Bachelor's degree in Material Science / STEM 관련 to Semi. Mfg.

Associate degree STEM related to Semi. Mfg.

Tools

Ion mill etcher

SEM/EDX

Dual beam FIB

Job description

Intel Corporation in Hillsboro, OR, is seeking a Materials Analysis Technician to perform material and failure analysis in support of silicon process development and high-volume manufacturing. You will help develop imaging, composition analysis, and sample prep techniques and share BKMs to improve lab output.

The role interfaces with TD and HVM customers, reliability engineers, and cross-functional teams to solve problems using SEM/EDX, FIB, TEM, and other characterization tools.