Process Integration Engineer: TEM & FIB Specialist

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 115,000 - 163,000; Full time

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Process Integration Development Engineer to perform FIB lamella preparation and TEM characterization on semiconducting nanostructures. The role supports TD and advanced metrology, focusing on imaging, diffraction, and advanced analysis.

The position requires hands-on FIB/TEM experience in industry, strong problem solving, and the ability to work independently or in teams. On-site work is required in Hillsboro.

Qualifications

• Hands-on FIB sample preparation and TEM prep operation in industry.
• Experience in semiconductor process integration and failure analysis.
• Strong communication skills and ability to work independently or in teams.
• Willingness to adapt to changing methods and tools.

Responsibilities

• Perform FIB lamella preparation and TEM characterization.
• Conduct TEM imaging, electron diffraction, and advanced analysis.
• Collaborate with engineering teams to optimize metrology strategies.
• Contribute to continuous improvement in high-volume manufacturing contexts.

Skills

FIB sample preparation

TEM imaging

TEM analysis

Team collaboration

Education

Associate degree

Bachelor's degree

Master's degree

Tools

FIB

TEM

Job description

Intel Corporation in Hillsboro, Oregon, seeks a Process Integration Development Engineer to perform FIB lamella preparation and TEM characterization on semiconducting nanostructures. The role supports TD and advanced metrology, focusing on imaging, diffraction, and advanced analysis.

The position requires hands-on FIB/TEM experience in industry, strong problem solving, and the ability to work independently or in teams. On-site work is required in Hillsboro.