Manager of Field Applications Engineering, USA

Baya Systems; Santa Clara, Austin (CA, TX); On-site; USD 170,000 - 250,000; Full time

Job summary

Baya Systems in the United States is seeking a Senior Manager of Field Applications Engineering to lead a nationwide FAEs team and drive pre‑ and post‑sales support for our fabric interconnect IP.

You will mentor engineers, shape regional goals, collaborate with sales, and push for high‑value design wins while ensuring customer success across data center, AI, automotive, and edge markets.

Qualifications

• Bachelor’s degree in Electrical or Computer Engineering.
• 5+ years managing customer-facing engineering teams (FAE or Technical Support).
• 10+ years in the semiconductor, silicon IP, or high-performance networking sectors.
• Excellent English communication and cross-cultural leadership.
• Willingness to travel up to 30%.

Responsibilities

• Lead a distributed team of senior FAEs across the USA.
• Recruit and onboard top-tier engineering talent in key regional hubs.
• Provide continuous technical mentorship and professional development.
• Set clear regional goals aligned with corporate objectives.
• Grow collaterals to enable improved efficiency and ease of adoption by the customer.
• Partner with regional sales directors to secure high-value design wins.
• Escalation point for critical customer technical issues.
• Oversee POC evaluations and architectural reviews.
• Deliver technical keynotes, deep-dives, and product demonstrations to C-level executives.
• Channel regional customer requirements to internal R&D and Product Management.
• Influence roadmap with market insights for fabric interconnect IP.
• Create application notes, whitepapers, and training collateral for regional ecosystems.

Skills

NoC knowledge

AMBA protocols

PCIe/CXL fabrics

Frontend ASIC design

RTL verification

EDA tools

AI/ML accelerators

Data center architectures

Automotive SoC

Team leadership

Education

Bachelor’s in Electrical/Computer Engineering

Master’s or PhD in EE/CE (preferred)

Tools

Synopsys

Cadence

Siemens EDA

Job description

Manager of Field Applications Engineering, USA

Baya Systems is inspired by the baya bird, also known as the weaver. Baya birds weave very unique and intricate hanging nests from different materials. The nests are robust and safe while being extremely lightweight and efficient.

Baya is a fast‑moving Series B startup built by serial entrepreneurs with a vision to accelerate intelligent computing in the emerging chiplet era. We focus on software‑driven, unified fabric solutions for single‑die and multi‑die systems. We design and license disruptive intellectual property for use in semiconductor chips, with software development platforms to simplify the design process and reduce the time to market for complex System‑on‑Chip (SoC) and multi‑chiplet systems. This enables our partners to innovate and deliver compelling solutions for data center, infrastructure, AI, automotive, and Edge IoT markets. We are looking for energetic and dedicated individuals who share our passion for enabling innovation and excellence in the semiconductor industry that empowers game‑changing products and services!

Role Overview

Lead and grow a world‑class Field Applications Engineering (FAE) team across the USA. Drive the technical adoption, integration, and design‑win pipeline for our next‑generation fabric interconnect silicon IP. Provide both pre‑ and post‑sales support. This is a very hands‑on role with significant individual contribution.

• Position: Senior Manager, Field Applications Engineering
• Location: North America
• Travel: Up to 30% required

Key Responsibilities

• Manage: Lead a distributed team of senior FAEs across the USA.
• Hire: Recruit and onboard top‑tier engineering talent in key regional hubs.
• Coach: Provide continuous technical mentorship and professional development.
• Align: Set clear regional goals aligned with corporate business objectives.
• Grow collaterals to enable improved efficiency and ease of adoption by the customer.
• Drive Strategy: Partner with regional sales directors to secure high‑value design wins.
• Own Delivery: Act as the escalation point for critical customer technical issues.
• Guide Evaluation: Oversee customer proof‑of‑concepts, evaluations, and architectural reviews.
• Present: Deliver technical keynotes, deep‑dives, and product demonstrations to C‑level executives.
• Feedback Loop: Funnel regional customer requirements directly to internal R&D and Product Management.
• Influence Roadmap: Use market insights to shape the future fabric interconnect IP roadmap.
• Enablement: Create application notes, whitepapers, and training collateral for regional ecosystems.

Required Qualifications

Experience & Education

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• Management: 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support).
• Industry: 10+ years in the semiconductor, silicon IP, or high‑performance networking sectors.

Technical Expertise

• IP Knowledge: Deep understanding of Network‑on‑Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics.
• Design Flow: Familiarity with front‑end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens).
• Systems: Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements.

Soft Skills & Logistics

• Communication: Exceptional English verbal and written communication skills.
• Cross‑Cultural: Proven experience managing teams and clients.
• Autonomy: Self‑motivated style suited for a fast‑paced, early‑stage startup environment.

Preferred Qualifications

• Master’s degree or PhD in Electrical or Computer Engineering.
• Prior experience working in a fast‑growing, venture‑backed silicon IP startup.
• Existing technical relationships with major Tier‑1 semiconductor and system companies in the USA.

Compensation

• Salary commensurate with experience.
• Performance incentives.
• Equity.