Manager of Field Applications Engineering, USA

jobr.pro; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Salary commensurate with experience

Performance incentives

Medical, dental, and vision benefits

401(k) retirement plan

Equity

Job summary

Baya is a fast‑moving startup enabling software‑driven fabric interconnect silicon IP for single‑die and multi‑die systems. We seek a Senior Manager, Field Applications Engineering to lead and grow the FAEs across the USA, driving adoption, integration, and design‑win opportunities with pre- and post‑sales support in a hands‑on role.

The position, based primarily in Santa Clara, CA with optional Austin, TX, requires up to 30% travel and strong leadership, technical, and communication skills to

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field.
• 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support).
• 10+ years in the semiconductor, silicon IP, or high‑performance networking sectors.

Responsibilities

• Lead a distributed team of senior FAEs across the USA.
• Recruit and onboard top-tier engineering talent in key regional hubs.
• Provide continuous technical mentorship and professional development.

Skills

Leadership

Team management

Client relationship management

English communication

Self-motivation

Education

Bachelor’s degree in Electrical/Computer Engineering or related STEM

Master’s or PhD (preferred)

Tools

Synopsys

Cadence

Siemens (EDA)

Job description

Manager, Field Applications Engineering

Baya is a fast‑moving Series B startup building software‑driven unified fabric solutions for single‑die and multi‑die systems. We design and license disruptive intellectual property for use in semiconductor chips, focusing on simplifying the design process for complex System‑on‑Chip and multi‑chiplet systems. Our goal is to empower partners in data center, infrastructure, AI, automotive, and edge IoT markets. We are looking for energetic and dedicated individuals who share our passion for enabling innovation and excellence in the semiconductor industry.

Role Overview

Lead and grow a world‑class Field Applications Engineering (FAE) team across the USA. Drive the technical adoption, integration, and design‑win pipeline for our next‑generation fabric interconnect silicon IP. Provide both pre‑and post‑sales support in a very hands‑on role with significant individual contribution.

Position: Senior Manager, Field Applications Engineering
Location: Santa Clara, CA (primary) – Austin, TX (optional)
Region: North America
Travel: Up to 30% travel required

Key Responsibilities

Team Leadership & Development

• Lead a distributed team of senior FAEs across the USA
• Recruit and onboard top‑tier engineering talent in key regional hubs
• Provide continuous technical mentorship and professional development
• Set clear regional goals aligned with corporate business objectives
• Grow collateral to enable improved efficiency and ease of adoption by customers

Technical Account Management & Sales Support

• Partner with regional sales directors to secure high‑value design wins
• Act as escalation point for critical customer technical issues
• Oversee customer proof‑of‑conceptions, evaluations, and architectural reviews
• Deliver technical keynotes, deep dives, and product demonstrations to C‑level executives

Product & Ecosystem Collaboration

• Funnel regional customer requirements directly to internal R&D and Product Management
• Use market insights to shape the future fabric interconnect IP roadmap
• Create application notes, whitepapers, and training collateral for regional ecosystems

Required Qualifications

Experience & Education

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related STEM field
• 5+ years of experience managing customer‑facing engineering teams (FAE or Technical Support)
• 10+ years in the semiconductor, silicon IP, or high‑performance networking sectors

Technical Expertise

• Deep understanding of Network‑on‑Chip (NoC), AMBA protocols (CHI, AXI, ACE), or PCIe/CXL fabrics
• Familiarity with front‑end ASIC design, SoC architecture, RTL verification, and EDA tools (Synopsys, Cadence, Siemens)
• Insight into AI/ML accelerators, data center architectures, and automotive SoC requirements

Soft Skills & Logistics

• Exceptional English verbal and written communication skills
• Proven experience managing teams and clients across cultures
• Self‑motivated with the ability to thrive in a fast‑paced, early‑stage startup environment

Preferred Qualifications

• Master’s degree or PhD in Electrical or Computer Engineering
• Prior experience working in a fast‑growing, venture‑backed silicon IP startup
• Existing technical relationships with major Tier‑1 semiconductor and system companies in the USA

Compensation and Benefits

• Salary commensurate with experience
• Performance incentives
• Comprehensive medical, dental, and vision benefits
• 401(k) retirement plan
• Equity