Low-Yield Characterization Engineer — Defect Analytics

Intel Corporation

Phoenix (AZ)

On-site

USD 134,000 - 189,000

Full time

4 days ago
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Benefits offered by this job

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Retirement plan
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Job summary

Intel Corporation in Phoenix, AZ seeks a Low Yield Analysis Engineer to drive root cause identification and yield improvements for advanced packaging and substrate technologies. You will lead complex investigations, develop characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development to resolve critical yield challenges.

The role is lab-based and on-site, requiring ownership, technical leadership, and mentoring of

Qualifications

  • Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience OR PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.
  • Prior experience working in a lab environment with hands-on experience with failure analysis and characterization techniques such as Optical Microscopy, SEM/EDS, CSAM, FTIR, Raman, TEM, EBSD, XRD or similar methodologies.
  • Experience with mechanical cross-sectioning, planar grinding, ion milling, focused ion beam (FIB), and advanced sample preparation techniques.
  • Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
  • Proficiency with statistical analysis and data analytics tools such as Python, JMP, JSL, SQL, or equivalent.
  • Track record of mentoring engineers and technicians and contributing to organizational capability development.
  • Experience developing new characterization techniques, analytical workflows, or problem-solving methodologies.

Responsibilities

  • Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.
  • Serve as a technical owner for major factory, platform, or technology development programs.
  • Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges.
  • Utilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
  • Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.
  • Consolidate and analyze large data sets using statistical methods and coding tools to identify yield limiters and emerging trends.
  • Develop and implement tools, dashboards, automation, and analytical methodologies that improve learning velocity and analysis efficiency.
  • Drive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.
  • Lead cross-functional task forces and technical reviews to address high-priority yield and reliability issues.
  • Present technical findings, recommendations, and risk assessments to engineering and management teams.
  • Mentor engineers and technicians while promoting best-known methods and organizational learning.
  • Support future capability development through equipment strategy, methodology development, and characterization roadmap planning.
  • Effectively manage multiple high-priority investigations while balancing customer commitments, factory priorities, and business needs.

Skills

Python
JMP
JSL
SQL

Education

Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field
PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field

Tools

SEM/EDS
CSAM
FTIR
Raman
TEM
EBSD
XRD
FIB
ion milling

Job description

Intel Corporation in Phoenix, AZ seeks a Low Yield Analysis Engineer to drive root cause identification and yield improvements for advanced packaging and substrate technologies. You will lead complex investigations, develop characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development to resolve critical yield challenges.

The role is lab-based and on-site, requiring ownership, technical leadership, and mentoring of

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