Defect Characterization Low Yield Analysis Engineer

Intel Corporation; Chandler (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation's Foundry Defect Characterization group seeks an experienced Low Yield Analysis (LYA) Engineer to drive root cause identification and yield improvement for advanced packaging assembly and substrate technology development programs.

The role requires leadership in complex investigations, development of characterization methodologies, and collaboration across manufacturing, quality, process integration, design and module technology development, with on-site work in the Phoenix, AZ

Qualifications

• Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience.
• PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.

Responsibilities

• Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.
• Serve as a technical owner for major factory, platform, or technology development programs.
• Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges.
• Utilize advanced analytical techniques to identify failure mechanisms.
• Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.
• Consolidate and analyze large data sets using statistical methods and coding tools.
• Develop tools, dashboards, automation, and analytical methodologies to improve learning velocity and analysis efficiency.
• Drive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.
• Lead cross-functional task forces and technical reviews to address high-priority yield and reliability issues.
• Present technical findings, recommendations, and risk assessments to engineering and management teams.
• Mentor engineers and technicians while promoting best-known methods and organizational learning.
• Support future capability development through equipment strategy and roadmap planning.
• Effectively manage multiple high-priority investigations balancing customer commitments and factory priorities.

Skills

Root-cause analysis

Mentoring

Cross-functional collaboration

Python

Statistical analysis

Education

Master's Degree in Materials/Mechanical/Electrical Engineering or Chemistry and Physics with 3+ years experience

PhD in Materials Science or related field

Tools

Optical Microscopy

SEM/EDS

CSAM

FTIR

Raman

TEM

EBSD

XRD

FIB / ion milling

Planar grinding

Job description

As a Low Yield Analysis (LYA) Engineer within Intel Foundry's Defect Characterization organization, you will drive root cause identification and yield improvement strategies for advanced packaging assembly and substrate technology development programs. You will lead complex technical investigations, develop innovative characterization methodologies, and collaborate across manufacturing, quality, process integration, design, and module technology development organizations to resolve critical yield challenges. This role requires a strong sense of ownership, urgency, technical leadership, and customer focus. The successful candidate will independently drive investigations, influence technical decisions, mentor team members, and deliver measurable business impact through yield improvement and defect characterization excellence.

Responsibilities

• Lead end-to-end investigations to identify and resolve complex yield, defect, and quality issues.
• Serve as a technical owner for major factory, platform, or technology development programs.
• Define characterization strategies, learning plans, and root cause methodologies for critical technical challenges.
• Utilize advanced analytical techniques including Optical Microscopy, SEM/EDS, EBSD, CSAM, FTIR, Raman, FIB, ion milling, and mechanical cross-sectioning to identify failure mechanisms.
• Correlate characterization results with electrical data, defect inspection data, process history, and manufacturing information to establish root cause.
• Consolidate and analyze large data sets using statistical methods and coding tools to identify yield limiters and emerging trends.
• Develop and implement tools, dashboards, automation, and analytical methodologies that improve learning velocity and analysis efficiency.
• Drive corrective actions and influence process improvements across manufacturing, integration, quality, and technology organizations.
• Lead cross-functional task forces and technical reviews to address high-priority yield and reliability issues.
• Present technical findings, recommendations, and risk assessments to engineering and management teams.
• Mentor engineers and technicians while promoting best-known methods and organizational learning.
• Support future capability development through equipment strategy, methodology development, and characterization roadmap planning.
• Effectively manage multiple high-priority investigations while balancing customer commitments, factory priorities, and business needs.

Behavioral traits

Demonstrated success managing multiple competing priorities in a fast-paced manufacturing or development environment. Communicate findings verbally and through reports to yield engineers, LYA analysts, and other customers. Work in a collaborative manner with a variety of different individuals in a fast paced, technical environment. Experience independently driving technical investigations and root cause analysis activities. Independently own open-ended technical problems, proactively drive actions across organizations, and deliver measurable business impact through root cause identification and implementation of corrective actions. Problem-solving, analytical, and troubleshooting skills. Verbal and written communication skills to communicate technical findings to diverse audiences. Operate effectively in ambiguous environments and drive technical issues to closure with minimal direction. This role is lab-based and on-site required.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through schoolwork and/or classes and/or project work and/or internships and/or military training and/or work experience.

Minimum Qualifications

• Master's Degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field with 3+ years of relevant semiconductor industry or failure analysis lab experience OR PhD in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, or Chemistry and Physics or related field.

Preferred Qualifications

• Prior experience working in a lab environment with hands-on experience with failure analysis and characterization techniques such as Optical Microscopy, SEM/EDS, CSAM, FTIR, Raman, TEM, EBSD, XRD or similar methodologies.
• Experience with mechanical cross-sectioning, planar grinding, ion milling, focused ion beam (FIB), and advanced sample preparation techniques.
• Advanced knowledge of semiconductor packaging, assembly, substrate manufacturing, or related process technologies.
• Proficiency with statistical analysis and data analytics tools such as Python, JMP, JSL, SQL, or equivalent.
• Track record of mentoring engineers and technicians and contributing to organizational capability development.
• Experience developing new characterization techniques, analytical workflows, or problem-solving methodologies.

Job Type

Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence.