Level 4 Microelectronic Assembler — Precision Wire Bonding

Honeywell Aerospace US LLC in; San Jose (CA); On-site; USD 44,000 - 55,000; Full time

Job summary

Honeywell Aerospace US LLC is seeking an Assembler - Level 4 with experience in wire bonding, gap welding, eutectic die attach, and epoxy attach. Two shifts are available: day (start 5-7am) or swing (start 3:30pm) within the Finance group.

You will ensure high-quality assembly of microelectronic components and maintain strict production standards. The role requires meticulous attention to detail, ability to work under a microscope for 8 hours, and collaboration with Process and Quality

Qualifications

• 4+ years in microelectronic, hybrid or semiconductor assembly.
• Ability to use tweezers and small hand-tools.
• Basic computer skills for documenting defects and time charging.
• Equipment set-up and calibration.
• Routine preventative maintenance tasks.
• US Person or eligible for export license.

Responsibilities

• Assemble devices and small components under a microscope.
• Work independently, own quality, and seek improvements.
• Participate in daily production goals with the team.
• Maintain a neat, orderly work area.
• Communicate in English and follow MIL-STD criteria.
• Perform equipment setup, calibration, and basic maintenance.
• Collaborate with Process and Quality Engineering to resolve issues.

Job description

Honeywell Aerospace US LLC is seeking an Assembler - Level 4 with experience in wire bonding, gap welding, eutectic die attach, and epoxy attach. Two shifts are available: day (start 5-7am) or swing (start 3:30pm) within the Finance group.

You will ensure high-quality assembly of microelectronic components and maintain strict production standards. The role requires meticulous attention to detail, ability to work under a microscope for 8 hours, and collaboration with Process and Quality