Lead Thermal Engineer - AI Data Center Cooling

Trane Technologies; Davidson (NC); On-site; USD 95,700 - 199,300; Full time

Benefits offered by this job

Health insurance

401K match

Paid time off

Tuition assistance

Job summary

Trane Technologies in the United States seeks a Thermal Systems Lead Engineer for the Technical Loop to shape cooling for high‑density data centers and AI compute. Lead roadmaps, serve as an internal cooling expert (direct‑to‑chip, immersion, 2‑phase), and partner with NVIDIA to align with future chip architectures.

You will mentor engineers, influence designs, and drive innovative, reliable thermal solutions across reference designs.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum of 7-10 years of engineering experience, with relevant current focus on thermal system management on data center cooling.
• Extensive experience in thermal design for IT hardware, electronics, or data centers.
• Deep understanding of single-phase and two-phase cooling technologies.
• Thermal system experience working with high-power processors and accelerators (CPUs, GPUs).
• Strong ability to collaborate with cross‑functional teams and external partners.
• The ability to thrive in a fast‑paced and dynamic environment serving mission critical customers

Responsibilities

• Lead the development of multi-generational system roadmaps for the technical cooling loop, focusing on AI data centers of varying scales.
• Serve as an internal expert on advanced cooling technologies, including direct-to-chip, immersion, and 2-phase cooling and heat rejection system design.
• Collaborate with partners like NVIDIA to ensure thermal solutions meet future chip architecture requirements (e.g., DSX2 and beyond).
• Translate customer requirements into detailed technical specifications for equipment and controls teams.
• Own the technical loop thermal management system design within current and future reference design architecture.
• Drive innovation by evaluating and integrating new cooling technologies and components into our system reference designs.
• Evaluate and select key components for the technical loop, such as pumps, valves, heat exchangers, and piping, with a focus on reliability, efficiency, and material compatibility.
• Provide coaching, mentorship, and technical guidance to junior engineers and cross‑functional team members, fostering a culture of knowledge sharing.
• Represent the company in industry standards bodies like ASHRAE and the Open Compute Project (OCP) to influence future data center design

Skills

Thermal design

Data center cooling

Cross-functional collaboration

Communication skills

English language

Education

Bachelor's or Master's in Mechanical or Electrical Engineering

Tools

Word

Excel

PowerPoint

Job description

Trane Technologies in the United States seeks a Thermal Systems Lead Engineer for the Technical Loop to shape cooling for high‑density data centers and AI compute. Lead roadmaps, serve as an internal cooling expert (direct‑to‑chip, immersion, 2‑phase), and partner with NVIDIA to align with future chip architectures.

You will mentor engineers, influence designs, and drive innovative, reliable thermal solutions across reference designs.