Lead Thermal Architect for AI Compute Platforms

Nutanix; San Diego (CA); On-site; USD 210,000 - 315,000; Full time

Job summary

Qualcomm Technologies, Inc. seeks a Principal Thermal Engineer to solve complex thermal challenges for the Dragonfly AI300 platform.

You will drive thermal architecture, validation, and optimization across silicon, packaging, and system levels, partnering with design and hardware teams to ensure peak performance and reliability. The role requires deep expertise in high-power electronics cooling, CFD tools, and hands-on testing, with strong communication and cross-functional leadership.

Qualifications

• Bachelor's/Master's/PhD in a relevant engineering field with 6–8+ years of experience in system/package cooling or equivalent.
• Experience in electronics cooling for AI/data-center products is required.
• Strong CFD/thermal simulation and test validation experience.

Responsibilities

• Lead thermal architecture solutions through simulation and test with stakeholders.
• Perform thermal simulations from silicon to data center environment.
• Conduct thermal tests and present results to stakeholders.

Skills

Thermal analysis

CFD tools

Python/C/C++

Matlab

Scripting for data analysis

Experimentation

Communication

Cross-functional collaboration

Education

Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering

Master's degree in Chem/EE/Mech

PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering

Tools

ANSYS Icepak

Celsius EC

Flotherm

Power/thermal test equipment

Job description

Qualcomm Technologies, Inc. seeks a Principal Thermal Engineer to solve complex thermal challenges for the Dragonfly AI300 platform.

You will drive thermal architecture, validation, and optimization across silicon, packaging, and system levels, partnering with design and hardware teams to ensure peak performance and reliability. The role requires deep expertise in high-power electronics cooling, CFD tools, and hands-on testing, with strong communication and cross-functional leadership.