Lead RF PCB Layout Engineer for Real-Time Earth Imaging

Array Labs; Redwood City, Northern (CA, KY); Hybrid; USD 160,000 - 200,000; Full time

Job summary

Array Labs seeks a Lead RF PCB Layout Engineer to own the physical implementation of RF and microwave electronics in Altium, translating schematic intent into manufacturable layouts. You will define stack‑ups, controlled‑impedance routing, and RF grounding strategies while partnering with multiple engineering teams to ensure first‑pass success and reliable performance.

Responsibilities include de‑risking layouts, supporting lab bring‑up, and guiding fabrication releases.

Qualifications

• B.S. in Electrical Engineering or related field with 8+ years of relevant experience.
• Experience in PCB layout, fabrication, and release of RF/high‑performance electronics.
• Strong teamwork and communication skills; self‑driven and fast‑paced environment.

Responsibilities

• Own RF PCB layout from initial placement through manufacturing release in Altium Designer.
• Define stack‑ups, controlled‑impedance routing, RF grounding and shielding strategies.
• Translate schematic intent into layouts meeting RF performance, including connectors and transitions.
• Collaborate with RF design, electrical, antenna, mixed‑signal, mechanical, and test engineers to set constraints and reviews.
• Drive DFM/DFT considerations with fabrication partners and release artifacts.

Skills

RF PCB layout

Team collaboration

Schematic translation

DFM/DFT awareness

Education

B.S. in Electrical Engineering

Tools

Altium Designer

Allegro

OrCAD

HFSS

CST

ADS Momentum

Job description

Array Labs seeks a Lead RF PCB Layout Engineer to own the physical implementation of RF and microwave electronics in Altium, translating schematic intent into manufacturable layouts. You will define stack‑ups, controlled‑impedance routing, and RF grounding strategies while partnering with multiple engineering teams to ensure first‑pass success and reliable performance.

Responsibilities include de‑risking layouts, supporting lab bring‑up, and guiding fabrication releases.