Lead RF & High-Speed PCB Design Engineer

Honeywell Aerospace; San Diego (CA); Hybrid; USD 143,000 - 180,000; Full time

Benefits offered by this job

Health benefits

401(k) match

Paid holidays

Paid time off

Educational assistance

Parental leave

Job summary

Honeywell Aerospace-EDS is seeking a Lead Mechanical Design Engineer in San Diego on a hybrid schedule to drive the design and development of complex RF/high-speed PCB layouts and advanced electronic packaging. You will lead the design process, ensuring quality and reliability across projects.

You will use Xpedition, Altium and PADS alongside 2D/3D tools (AutoCAD, NX, SolidWorks) while collaborating with a cross-functional team and reporting to the Senior Manager of Design Engineering.

Qualifications

• Eight or more years of related experience designing high frequency products that utilize multilayer mixed mode SMT with MIC design approaches.
• Strong knowledge of electronics packaging and MIC design, packaging and processes is a plus.
• Experience with metal fabrication, electronics assembly and manufacturing flow; familiarity with IPC 2220 series standards.

Responsibilities

• Generate circuit layouts and drawings from engineering inputs (schematics, block diagrams, flow charts).
• Incorporate ECAD changes using Xpedition, Altium or PADS for ECAD, AutoCAD for 2D, Siemens NX and SolidWorks for MCAD.
• Prepare parts lists and enter data into PLM systems (Agile, Teamcenter).
• Interface with Engineering to define mechanical assembly approaches for manufacturing and production.
• Understand and support RF and DC circuit impedance, temperature rise and voltage drop calculations.

Skills

Mechanical design

PCB design

GD&T

Team collaboration

Communication

Education

Bachelor’s degree in technical field

Electrical/Electronics Engineering degree or equivalent

Associate Degree in Design Drafting

Tools

Xpedition

Altium

PADS

AutoCAD 2D

Siemens NX

SolidWorks

Job description

Honeywell Aerospace-EDS is seeking a Lead Mechanical Design Engineer in San Diego on a hybrid schedule to drive the design and development of complex RF/high-speed PCB layouts and advanced electronic packaging. You will lead the design process, ensuring quality and reliability across projects.

You will use Xpedition, Altium and PADS alongside 2D/3D tools (AutoCAD, NX, SolidWorks) while collaborating with a cross-functional team and reporting to the Senior Manager of Design Engineering.