Lead Photonic Packaging Engineer

PHIX

Bozeman (MT)

On-site

USD 90,000 - 130,000

Full time

14 days+

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Benefits offered by this job

PTO
401(k) match
Health insurance

Job summary

PHIX is seeking a Photonic Packaging Engineer in Bozeman, MT to advance PIC packaging and assembly processes. You will lead customer projects, translate requirements into precise designs, and partner with engineers to improve manufacturability.

The role emphasizes hands-on packaging, process innovation, and scalable automation, with collaboration across an enthusiastic international team and opportunities to contribute to cutting-edge photonic technologies.

Qualifications

  • MSc in photonics/optical science, physics, electrical engineering, microelectronics or related field.
  • Minimum of 3 years in photonic or electronic packaging or testing.
  • Proficiency with Six Sigma in development and process improvement.
  • Experience with optical design software (e.g., Zemax) for simulating optical systems.
  • Independent, well-organized and good reporting skills.

Responsibilities

  • Perform hands-on packaging and assembly of PIC-based modules.
  • Translate customer requirements into detailed assembly designs.
  • Collaborate with design engineers to optimize product designs.
  • Innovate optical interconnection methods for integration.
  • Design and refine assembly setups for validation and prototyping.
  • Implement automation to improve efficiency and scalability.

Skills

Six Sigma in product development
Independent worker
Strong communication
Documentation

Education

MSc in photonics/optical science/physics/EE/microelectronics

Tools

Ansys Zemax

Job description

PHIX is seeking a Photonic Packaging Engineer in Bozeman, MT to advance PIC packaging and assembly processes. You will lead customer projects, translate requirements into precise designs, and partner with engineers to improve manufacturability.

The role emphasizes hands-on packaging, process innovation, and scalable automation, with collaboration across an enthusiastic international team and opportunities to contribute to cutting-edge photonic technologies.

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