Photonic Packaging Engineer

PHIX; Bozeman (MT); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

PTO

401(k) match

Health insurance

Job summary

PHIX is seeking a Photonic Packaging Engineer in Bozeman, MT to advance PIC packaging and assembly processes. You will lead customer projects, translate requirements into precise designs, and partner with engineers to improve manufacturability.

The role emphasizes hands-on packaging, process innovation, and scalable automation, with collaboration across an enthusiastic international team and opportunities to contribute to cutting-edge photonic technologies.

Qualifications

• MSc in photonics/optical science, physics, electrical engineering, microelectronics or related field.
• Minimum of 3 years in photonic or electronic packaging or testing.
• Proficiency with Six Sigma in development and process improvement.
• Experience with optical design software (e.g., Zemax) for simulating optical systems.
• Independent, well-organized and good reporting skills.

Responsibilities

• Perform hands-on packaging and assembly of PIC-based modules.
• Translate customer requirements into detailed assembly designs.
• Collaborate with design engineers to optimize product designs.
• Innovate optical interconnection methods for integration.
• Design and refine assembly setups for validation and prototyping.
• Implement automation to improve efficiency and scalability.

Skills

Six Sigma in product development

Independent worker

Strong communication

Documentation

Education

MSc in photonics/optical science/physics/EE/microelectronics

Tools

Ansys Zemax

Job description

Are you passionate about the cutting-edge field of photonic integrated circuits? Do you thrive on solving complex challenges in electronic and photonic IC packaging? If so, we have an exciting opportunity for you! As a Photonic Packaging Engineer at PHIX, you will be developing and refining innovative PIC packaging and assembly processes. Your role will involve leading customer projects, translating their unique requirements into precise assembly designs, and collaborating closely with our engineering team to optimize product designs for manufacturability. This position offers an opportunity to contribute to new advancements in photonic technologies and play a key role in the success of innovative projects.

Your primary responsibilities will include

• Perform hands-on packaging and assembly of PIC based modules
• Translate diverse customer requirements into detailed assembly design
• Collaborate closely with design engineers to optimize product designs.
• Innovate optical interconnection methods for seamless integration.
• Design and refine assembly setups for effective validation and prototyping.
• Implement automation techniques to enhance assembly efficiency and ensure scalability.

• Hold an MSc. degree in photonics/optical science, physics, electrical engineering, microelectronics or a related field.
• Minimum of 3 years of professional experience in photonic or electronic packaging or testing.
• Proficiency in applying Six Sigma in product development and process improvement
• Experience with optical design software, such as Ansys Zemax, for simulating and optimizing optical systems.
• Practical and pragmatic approach to problem-solving.
• Ability to work independently with strong communication skills.
• Excellent personal organization and proficiency in reporting and documentation.

What we offer you

• A position in the emerging field of photonic IC packaging, offering numerous exciting challenges and opportunities for personal initiative and growth.
• Being part of a young, dynamic and enthusiastic international team.
• Benefits include paid time off (PTO), 401k match, health insurance.
• Position is exempt from overtime.