Lead PCB Fabrication Process Engineer: High-Speed SI/PI

Advanced Micro Devices; California (MO); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Benefits at a glance

Equal opportunity employer

Job summary

AMD is seeking a Lead PCB fabrication process engineer to drive performance, quality and reliability of high-speed PCB stacks for Datacenter GPU Platform PCBs. You will collaborate with silicon/package design, board engineering, and supply chain to address SI/PI challenges and bring designs to mass production.

The ideal candidate has a strong background in complex fabrication processes, high-performance electronics hardware, and experience with failure analysis, design for manufacturability, and

Qualifications

• Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical… etc.).
• Master's degree preferred in Electrical/Electronics & Computer Engineering.
• Strong background in high-speed PCB design and analysis.
• Experience with destructive and non-destructive PCB failure analyses.

Responsibilities

• Design high performance material stacks & complex via-structure interconnects for Datacenter GPU Platform PCBs.
• Address Design for Manufacturing queries to mitigate fabrication yield issues and derisk schedules.
• Own process qualification and adoption of PCB fabrication technologies for SI/PI requirements.
• Define technology roadmaps, vendor engagements, and robust architecture design practices.
• Collaborate with silicon/package design and cross-functional teams to enable PCB solutions.
• Contribute to overall Platform quality from feasibility to mass production ramp.
• Drive process improvements while enabling fast time-to-market product delivery.

Skills

High-speed design

SI/PI optimization

Python scripting

3DXRM

Stack impedance analysis

DFM/FPY improvement

Education

Bachelor's degree in Engineering

Master's degree preferred

Tools

Allegro

3DXRM

Job description

AMD is seeking a Lead PCB fabrication process engineer to drive performance, quality and reliability of high-speed PCB stacks for Datacenter GPU Platform PCBs. You will collaborate with silicon/package design, board engineering, and supply chain to address SI/PI challenges and bring designs to mass production.

The ideal candidate has a strong background in complex fabrication processes, high-performance electronics hardware, and experience with failure analysis, design for manufacturability, and