PCB Fabrication Process Engineer

Advanced Micro Devices; California (MO); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Benefits at a glance

Equal opportunity employer

Job summary

AMD is seeking a Lead PCB fabrication process engineer to drive performance, quality and reliability of high-speed PCB stacks for Datacenter GPU Platform PCBs. You will collaborate with silicon/package design, board engineering, and supply chain to address SI/PI challenges and bring designs to mass production.

The ideal candidate has a strong background in complex fabrication processes, high-performance electronics hardware, and experience with failure analysis, design for manufacturability, and

Qualifications

• Bachelor's degree in Engineering (Electrical/Computer/Mechanical/Chemical… etc.).
• Master's degree preferred in Electrical/Electronics & Computer Engineering.
• Strong background in high-speed PCB design and analysis.
• Experience with destructive and non-destructive PCB failure analyses.

Responsibilities

• Design high performance material stacks & complex via-structure interconnects for Datacenter GPU Platform PCBs.
• Address Design for Manufacturing queries to mitigate fabrication yield issues and derisk schedules.
• Own process qualification and adoption of PCB fabrication technologies for SI/PI requirements.
• Define technology roadmaps, vendor engagements, and robust architecture design practices.
• Collaborate with silicon/package design and cross-functional teams to enable PCB solutions.
• Contribute to overall Platform quality from feasibility to mass production ramp.
• Drive process improvements while enabling fast time-to-market product delivery.

Skills

High-speed design

SI/PI optimization

Python scripting

3DXRM

Stack impedance analysis

DFM/FPY improvement

Education

Bachelor's degree in Engineering

Master's degree preferred

Tools

Allegro

3DXRM

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re redesigning next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger- technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

We are looking for a talented and energetic Lead Printed Circuit Board (PCB) fabrication process engineer to complement the existing skillsets of our Platform development team. In this role, you will be responsible for driving PCB performance, quality and reliability specifications: including but not limited to high-speed signal & power integrity (SI/PI) optimized stacks and interconnect structures for volume manufacturing. To accomplish this, you will interact frequently with key teams leading silicon/package design, board schematics/layout engineering, system validation, device failure analysis and supply chain/procurement activities within AMD, external industry consortiums, our customer teams, and strategic ODM & joint development partners.

THE PERSON:

As a Leader in Systems Design Engineering, you will be responsible for ensuring best-in-class performance and reliability of cutting-edge PCB designs. The suitable candidate will require a strong background & solid understanding of complex fabrication processes, high performance electronics hardware, and technical expertise in assembly reliability test/failure analyses. Effective communication skills, a collaborative mindset, detail-orientation, innovative critical problem solving/ troubleshooting, and organized data collection are critical qualities for success in this role.

KEY RESPONSIBILITIES:

• Design high performance material stacks & complex via-structure interconnects to enable AMD's next generation of Datacenter GPU PlatformPCBs
• Effectively address/close Design for Manufacturing queries in a timely manner to mitigate fabrication yield issues & deriskon-schedule delivery of critical builds
• Owntheprocess qualification & adoption of PCBfabricationtechnologiesrequiredtoaddressrapidly evolvingSignal Integrity, Power Delivery, and Thermal-Mechanical related performance specifications
• Define technologyroadmaps, vendor engagements,andhelp implementrobustarchitecturedesign practices forperformance, cost, and manufacturability
• Collaborate with silicon/package design, board engineering/layout, and other cross-functional teams toenablePCB solutions from package to system level
• Contribute to overallPlatformquality from conceptualization/feasibility planningstage through NPI & mass volume productionramp
• Drive process improvements while executing fast time-to-market product delivery
• Function decisivelyin a dynamic&fast-paced product development environment

PREFERRED EXPERIENCE:

• Strong background in high-speed design, robust strategies for PCIe & Memory routing, and optimal PCB material selection dependent on application end-use
• Expertise in destructive and non-destructivePCBfailure/root cause analyses using 3DXRM, SEM, Thermal analysis (DSC, DMA...etc.), and FTIR Spectroscopy
• Familiarity with 2D/3D Allegro (or other) Stack Impedance and Loss simulation tools required for SI/PI-focused interconnect optimizations
• Ability to write scripts in programming languages (i.e. Python, C/C++, MATLAB, etc.) for statistical data analysis & tool development
• Excellent verbal & written communication skills at engineering and executive levels, including a proven track record of working effectively across organizational boundaries to define process requirements, solve complex problems and drive program-related investigations to successful completion
• Laboratory Acumen - Experience with Design of Experiments, instrumentation, data acquisition and analyses, including uncertainty analysis
• PCB Manufacturing - Sound knowledge of design & fabrication guidelines,in-depth understanding ofPCBA-related failuremechanisms including CAF,PTH/viacracking,pad cratering/solder ball stress,glass-stop &delaminationriskandprovenexperience with volume manufacturingsuppliersin Asia&North America

ACADEMIC CREDENTIALS:

• Required -Bachelor's degree in Engineering(Electrical/Computer/Mechanical/Chemical…etc.)
• Preferred -Master's degree in Electrical/Electronics & Computer Engineering

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s "Responsible AI Policy" is available here.

This posting is for an existing vacancy.