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Key responsibilities include EMI/EMC and ESD considerations, board layout, and creation of complete fabrication packages for high-volume production. A strong background in MIL‑STD and small-form-factor designs is required.
Key responsibilities include EMI/EMC and ESD considerations, board layout, and creation of complete fabrication packages for high-volume production. A strong background in MIL‑STD and small-form-factor designs is required.