Lead HDI PCB Layout Engineer - Defense & Space (Cincinnati)

Actalent; Cincinnati (OH); On-site; USD 85,000 - 96,000; Full time

Job summary

Actalent is hiring a Principal PCB Layout Design Engineer to deliver high‑reliability circuit card assemblies for aerospace, defense, and space flight. The role requires extensive PCB layout experience, including high-density, high-speed, RF, and complex multi‑layer boards, on-site in Cincinnati, OH.

You will collaborate across electrical, mechanical, and manufacturing teams, apply IPC/military standards, and guide DFx reviews to improve yield and robustness.

Qualifications

• 5+ years of PCB layout experience with PADS.
• Layout of high-speed, RF, mixed-signal PCBs.
• Collaborates with diverse stakeholders across programs.
• Knowledge of PCB fabrication and assembly processes.
• Familiarity with IPC standards for PCB design.
• Experience generating artwork and documentation for procurement.
• Strong organizational and problem-solving skills.
• Willingness to work on-site in Cincinnati, OH.

Responsibilities

• Place and route complex multilayer PCBs including high-speed and RF.
• Interpret schematics and constraints to optimize layouts.
• Create fabrication and assembly documentation for procurement and assembly partners.
• Apply IPC and military/aerospace criteria in design and verification.
• Collaborate with electrical, mechanical, manufacturing, and SI teams.
• Lead DFM, DFA, and DFT reviews to improve yield and robustness.
• Work with suppliers to understand manufacturing capabilities and constraints.
• Manage PCB library: symbols, footprints, and data per internal workflows.
• Own PCB layout tasks from concept to data release.
• Lead advanced layout using HDI, via-in-pad, and specialized substrates.

Skills

PADS layout

HDI PCBs

RF & high-speed

IPC/military standards

DFM/DFT/ DFA reviews

Job description

Actalent is hiring a Principal PCB Layout Design Engineer to deliver high‑reliability circuit card assemblies for aerospace, defense, and space flight. The role requires extensive PCB layout experience, including high-density, high-speed, RF, and complex multi‑layer boards, on-site in Cincinnati, OH.

You will collaborate across electrical, mechanical, and manufacturing teams, apply IPC/military standards, and guide DFx reviews to improve yield and robustness.