Lead Electroplating & Backend Integration Engineer

Lumicity

Albuquerque (NM)

On-site

USD 140,000 - 190,000

Full time

5 days ago

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Job summary

Lumicity is seeking a hands-on Engineering Manager to own backend thick Cu (bump) integration in a growing semiconductor manufacturing environment in Albuquerque, NM. This full-time role offers visibility to executives and opportunities to scale processes as the company expands.

You will lead electroplating activities, drive R&D, and mentor teams to improve quality, yields, and efficiency while maintaining safety and reliability.

Qualifications

BS in Engineering (required).
10+ years in semiconductor manufacturing environment.
Solid knowledge of thick Cu (bump) integration.
Experience with photolithography, electroplating, spin-on dielectrics and laminate films.
People management or program leadership experience.
Strong written and verbal communication; ability to work across all levels.

Responsibilities

Serve as technical authority in electroplating and lead R&D to expand capabilities.
Lead dicing, etch, and solder ball attach efforts.
Drive CI/DOE to improve quality, yields, and production rates while reducing costs.
Partner with external companies/universities on integration advances.
Root cause failures using statistics and adjust designs/processes.
Present to executives and lead teams/projects.

Skills

Thick Cu integration

Semiconductor manufacturing

Leadership

Photolithography

Electroplating

Spin-on dielectrics

Laminate films

Communication

Adaptability

Design of Experiments

Education

Bachelor's degree in Engineering

Job description

You will lead electroplating activities, drive R&D, and mentor teams to improve quality, yields, and efficiency while maintaining safety and reliability.

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