Electroplating Engineering Manager

Lumicity; Albuquerque (NM); On-site; USD 140,000 - 190,000; Full time

Job summary

Lumicity is seeking a hands-on Engineering Manager to own backend thick Cu (bump) integration in a growing semiconductor manufacturing environment in Albuquerque, NM. This full-time role offers visibility to executives and opportunities to scale processes as the company expands.

You will lead electroplating activities, drive R&D, and mentor teams to improve quality, yields, and efficiency while maintaining safety and reliability.

Qualifications

• BS in Engineering (required).
• 10+ years in semiconductor manufacturing environment.
• Solid knowledge of thick Cu (bump) integration.
• Experience with photolithography, electroplating, spin-on dielectrics and laminate films.
• People management or program leadership experience.
• Strong written and verbal communication; ability to work across all levels.

Responsibilities

• Serve as technical authority in electroplating and lead R&D to expand capabilities.
• Lead dicing, etch, and solder ball attach efforts.
• Drive CI/DOE to improve quality, yields, and production rates while reducing costs.
• Partner with external companies/universities on integration advances.
• Root cause failures using statistics and adjust designs/processes.
• Present to executives and lead teams/projects.

Skills

Thick Cu integration

Semiconductor manufacturing

Leadership

Photolithography

Electroplating

Spin-on dielectrics

Laminate films

Communication

Adaptability

Design of Experiments

Education

Bachelor's degree in Engineering

Job description

Electroplate & Backend Engineering Manager | Thick Cu (Bump) Integration

Full-time | Semiconductor Manufacturing

We're partnering with a growing semiconductor manufacturer to hire a hands-on technical leader to own its backend thick Cu (bump) integration. This role has full visibility to the executive management team and real room to advance as the company scales.

What you'll do

• Serve as the technical authority in electroplating and lead R&D to expand current capabilities
• Lead dicing, etch, and solder ball attach efforts
• Drive manufacturing continuous improvement, using disciplined problem-solving and design of experiments
• Improve quality, yields, production rates, and efficiency while reducing costs and keeping systems safe and reliable
• Partner with external companies and universities on the latest integration advances
• Find root causes of failures using statistical methods and recommend changes to designs, tolerances, or processes
• Present to company executives and lead teams and projects

What you'll bring

• BS in Engineering
• 10+ years in a semiconductor manufacturing environment, with solid knowledge of thick Cu (bump) integration
• Working knowledge of photolithography, electroplating, spin-on dielectrics, and laminate films
• People management or program leadership experience
• Strong written and verbal communication, and comfort working across all levels of an organization
• Adaptability in a fast-moving environment

Nice to have

• Experience taking processes from R&D to high-volume manufacturing

Eligibility: This role requires lawful access to ITAR/EAR-controlled information. Candidates must be a US Citizen, US Permanent Resident, or able to meet contract-specific licensure requirements.