Lead DRAM Dry Etch Engineer — Shape Next‑Gen Memory

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise invites you to join the DRAM Dry Etch team. You will develop and optimize plasma etch processes that enable next-generation memory devices, taking concepts from early development through manufacturing implementation.

This role offers broad technical ownership, hands-on experimentation, and the chance to shape future technology roadmaps while collaborating across process, integration, and manufacturing teams.

Qualifications

• MS or PhD with 3–5 years of relevant experience; or BS with 5–10 years semiconductor experience.
• Experience in dry etch process development within semiconductor manufacturing or R&D.
• Understanding of plasma physics, dry etch chemistries, and reactor fundamentals.
• Experience using statistical methods, SPC, and data-driven problem solving.
• Ability to manage multiple projects and collaborate across teams.

Responsibilities

• Develop and optimize dry etch processes to meet structural and electrical requirements
• Collaborate with integration and process teams to solve complex device and process challenges
• Perform root cause analysis and drive yield, defect, and process improvements
• Analyze data to improve process capability, stability, and manufacturing readiness
• Support process transfer, project execution, and production issue resolution

Skills

Dry etch development

Plasma physics

SPC data analysis

Cross-functional collaboration

Education

MS or PhD in a related field

Bachelor's degree in related field

Tools

ICP dry etch

CCP dry etch

Job description

Micron Technology, Inc. in Boise invites you to join the DRAM Dry Etch team. You will develop and optimize plasma etch processes that enable next-generation memory devices, taking concepts from early development through manufacturing implementation.

This role offers broad technical ownership, hands-on experimentation, and the chance to shape future technology roadmaps while collaborating across process, integration, and manufacturing teams.