Lead Avionics Mechanical Design for Spacecraft

Firefly Aerospace; Leander (TX); On-site; USD 110,000 - 180,000; Full time

Benefits offered by this job

Health, dental & vision plans

Relocation assistance

Educational reimbursement

Job summary

Firefly Aerospace is seeking an Avionics Mechanical Engineer to design rugged electronics packaging and electro-mechanical assemblies for launch vehicle and spacecraft applications. You will own complex subsystems, guide design architectures, and mentor junior engineers across multidisciplinary teams to ensure mission success.

The role requires 5+ years in high-reliability electronics packaging, NX CAD proficiency, and GD&T experience.

Qualifications

• 5+ years of professional industry experience designing high-reliability electronics packaging and electro-mechanical assemblies.
• 3D CAD design (NX preferred) and geometric dimensioning and tolerancing.
• Experience with multi-layer PCBA enclosure design and thermal management.

Responsibilities

• Lead design and architecture of ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicle and spacecraft applications.
• Design and optimize electro-mechanical assemblies for extreme thermal/dynamic environments and EMI/EMC compatibility.
• Perform and review advanced thermal analyses (steady-state, transient, thermal cycling).
• Define, execute, and lead vibration, shock, and TVAC environmental test campaigns for product qualification and acceptance.
• Mentor and guide junior and mid-level engineers, establishing design best practices.

Skills

Mechanical design

Team leadership

Mentoring

Problem solving

Education

Bachelor of Science in Mechanical Engineering, Aerospace Engineering, or related field

Tools

NX CAD

ANSYS

Job description

Firefly Aerospace is seeking an Avionics Mechanical Engineer to design rugged electronics packaging and electro-mechanical assemblies for launch vehicle and spacecraft applications. You will own complex subsystems, guide design architectures, and mentor junior engineers across multidisciplinary teams to ensure mission success.

The role requires 5+ years in high-reliability electronics packaging, NX CAD proficiency, and GD&T experience.