Aerospace Electronics Packaging Engineer II

Cedarparktexasedc; Cedar Park (TX); On-site; USD 85,000 - 120,000; Full time

Job summary

Cedarparktexasedc is seeking a Mechanical Engineer II to design rugged electronics packaging and mechanical components for launch vehicles. You will develop enclosures, integration hardware, tooling and test fixtures, and collaborate closely with the avionics team and PCB design to ensure proper mounting, clearances and thermal interfaces.

The role involves performing thermal analyses, modal and vibration studies, creating CAD models in NX, generating part drawings and documentation, and

Qualifications

• Bachelor of Science in mechanical or aerospace engineering or related field.
• 3+ years engineering experience in electronics packaging or electro‑mechanical assemblies.
• 3+ years of 3D CAD design and drafting experience.

Responsibilities

• Design rugged electronics packaging and structural components for PCB assemblies used for launch vehicles and spacecraft.
• Design electro‑mechanical assemblies for thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance.
• Perform thermal analyses (steady state thermal and thermal cycling) of electronics in aerospace environments.
• Perform modal and vibration analyses of electronic assemblies with mechanical/structural components.
• Develop CAD designs, part drawings, assembly drawings, and technical documentation including presentations and reports.
• Work with the PCB design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces.

Skills

Electronics packaging design

3D CAD design

NX CAD

ANSYS

Thermal analysis

Vibration analysis

Mechanical design

Education

Bachelor of Science in Mechanical Engineering

Tools

NX

ANSYS

Job description

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Mechanical Engineer II

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SUMMARY

Firefly Avionics Mechanical Engineers will leverage their creative design and experience to develop electronics enclosures, mechanical components, integration hardware, tooling, and test fixtures for launch vehicles. Qualified candidates will be responsible for design, analysis, hands-on build/integration, and support of environmental testing. You will be part of the avionics team and will work closely and collaborate with all other teams across the company.

RESPONSIBILITIES

• Design ruggedized electronics packaging and structural components for PCB assemblies used for launch vehicle and spacecraft applications
• Design electro-mechanical assemblies for thermal and dynamic environments, EMI/EMC compatibility, and radiation resistance
• Perform thermal analyses (steady state thermal and thermal cycling) of electronics in aerospace environments
• Perform modal and vibration analyses of electronic assemblies with mechanical/structural components
• In addition to electronics packaging, candidate will be responsible for design of test fixturing and ground support hardware for launch vehicle and spacecraft electronics
• Support vibration, shock, and thermal test campaigns of products designed
• Candidate will be responsible for development of CAD designs, part drawings, assembly drawings, and technical documentation including presentations and reports
• Work with the PCB design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly

QUALIFICATIONS

Required

• Bachelor of Science in mechanical engineering, aerospace engineering, or related field
• 3+ years of engineering experience designing electronics packaging and electro-mechanical assemblies via internships, professional industry experience, or academia
• 3+ years of 3D CAD design and drafting experience

Desired

• Hands on experience with design and integration of electronics packaging
• Proficiency with NX or similar CAD software and analysis tools such as ANSYS
• Experience with multi-layer PCBA enclosure design
• Experience with various design features and calculations for mechanical packaging of electronics including vent analyses, EMI/EMC mitigation strategies, multi-component tolerance stack-up calculations, bolt load calculations, Steinberg PCB solder joint fatigue, etc.
• Understanding of basic subsystems of a launch vehicle and how avionics integrate within the vehicle and interface with instrumentation
• Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes
• Experience with environmental analysis and test including thermal cycle, thermal vacuum, shock, and vibration
• Understanding and knowledge of GD&T

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