Mechanical Engineering Lead – Avionics

Firefly Aerospace; Cedar Park (TX); On-site; USD 110,000 - 150,000; Full time

Job summary

Firefly Aerospace seeks a lead avionics mechanical engineer to design rugged electronics packaging for PCB assemblies used in launch vehicles. You will conduct advanced thermal and structural analyses and drive environmental testing for qualification.

You will create CAD models, drawings, and documentation, and mentor junior engineers while coordinating with cross-functional teams across the company.

Qualifications

• Bachelor of Science in Mechanical/Aerospace engineering and 5 years in aerospace packaging.
• 3D CAD (NX) with GD&T experience.
• Experience taking electro-mechanical products from concept to qualification.

Responsibilities

• Lead design and architecture of ruggedized electronics packaging for PCB assemblies.
• Perform thermal analyses (steady-state, transient, cycling) for space environments.
• Perform modal/ random vibration and shock analyses to ensure launch integrity.
• Define and lead TVAC environmental test campaigns for qualification.
• Create CAD models, drawings, and technical documentation; lead design reviews.

Skills

Mechanical design

Thermal analysis

Electro-mechanical design

Leadership

Thermal management

Education

B.S. in Mechanical/Aerospace Engineering

Tools

NX CAD

ANSYS

Job description

ABOUT Firefly Aerospace is a space and defense technology company on a mission to reliably and repeatedly launch land and operate space systems from Earth to the Moon and beyond As the partner of choice for critical space missions Firefly is the first commercial company to launch a satellite to orbit with 24 hour notice and the first company to achieve a successful Moon landing Headquartered in north Austin Texas Firefly is looking for passionate hardworking innovators to join our team and help fuel our successful trajectory into space

SUMMARY

Firefly Avionics Mechanical Engineers leverage their creative design and deep industry experience to develop electronics enclosures mechanical components integration hardware tooling and test fixtures for launch vehicles As the lead you will be expected to own complex avionics subsystems lead design architectures and mentor junior engineers Qualified candidates will be responsible for the full product lifecycleincluding advanced design rigorous analysis hands on buildintegration and qualification testing You will be a key technical voice within the avionics team and will collaborate heavily with multidisciplinary teams across the company to ensure mission success

RESPONSIBILITIES

• Lead design and architecture of ruggedized electronics packaging and structural components for PCB assemblies used in launch vehicle and spacecraft applicationsDesign and optimize complex electro mechanical assemblies for extreme thermal and dynamic environments EMIEMC compatibility and radiation resistancePerform and review advanced thermal analyses steady state transient and thermal cycling of electronics in space environmentsPerform and review modal random vibration and shock analyses of electronic assemblies to ensure structural integrity during launchOversee the design of high reliability test fixturing and ground support equipment GSE for launch vehicle and spacecraft electronicsDefine execute and lead vibration shock and thermal vacuum TVAC environmental test campaigns for product qualification and acceptanceDrive the creation of CAD models engineering drawings and technical documentation; lead formal design reviews PDR CDR and present to leadershipPartner closely with the PCB design team to establish mounting strategies keep outs tolerance stack ups connector placement and advanced thermal management solutionsMentor and guide junior and mid level engineers establishing design best practices and reviewing their technical work

QUALIFICATIONS

• Required Bachelor of Science in Mechanical Engineering Aerospace Engineering or a related technical field5 years of professional industry experience designing high reliability electronics packaging and electro mechanical assemblies preferably in aerospace defense or automotive3D CAD design NX preferred and geometric dimensioning and tolerancingProven track record of taking complex electro mechanical products from initial concept through environmental qualification and productionDesired Proficiency with NX CAD and finite element analysis FEA tools such as ANSYSExperience with multi layer PCBA enclosure design including complex thermal interface materials TIMs and CTE analysisStrong understanding of structural and thermal calculations including vent analyses EMIEMC shielding worst case tolerance stack ups bolt pre loads and Steinberg PCB solder joint fatigue life predictionsSystems level understanding of launch vehicle architectures instrumentation interfaces and avionics master networksExpert knowledge of manufacturing methodologies 5 axis CNC machining sheet metal additive manufacturing and materialplating selection for spaceflight environmentsExperience interfacing with external vendors and manufacturing partners to resolve DFM issues and expedite production