Lead Applications Engineer, Active Copper & Sintering

NCSL International; Wilmington (DE); Hybrid; USD 109,000 - 164,000; Full time

Benefits offered by this job

Competitive base salary

Performance bonus

401(k) with company matching

Life Insurance

Medical Insurance

9 holidays

Job summary

Element Solutions seeks a Sr. R&D Applications Engineer at the Wilmington, DE site to lead paste deposition process development for Active Copper.

You will mentor the Wilmington team, partner with R&D Innovation in San Jose, and coordinate with PCB & IC Substrate experts to ensure scalable, defect-free deposition suitable for high-volume manufacturing. Responsibilities include experimental design, data analysis, and presenting technical results to internal and external partners.

Qualifications

• MS with 7+ years in electronics manufacturing, materials science or related field.
• BS with 11+ years in electronics manufacturing, materials science or related field.
• Strong experience with printing, dispensing, sintering and plating equipment.

Responsibilities

• Lead full development of the paste deposition process for Active Copper.
• Provide technical supervision and mentoring to the Wilmington team.
• Integrate deposition processes into full board builds (preplate, sinter, post-plate, planarization).
• Design and execute systematic studies using advanced printing and deposition equipment.
• Interface with customers during technical reviews and troubleshooting.

Skills

DOE

Six Sigma

Statistical analysis

Mentoring

Team leadership

Safety culture

Travel readiness

Education

MS with 7+ years experience in electronics manufacturing/materials science

BS with 11+ years experience in electronics manufacturing/materials science

Mechanical/ Chemical/ Industrial Engineering or Materials Science

Tools

Printing equipment

Dispensing equipment

Sintering equipment

Plating equipment

Vacuum-assisted printing

PCB sinter press

Job description

Element Solutions seeks a Sr. R&D Applications Engineer at the Wilmington, DE site to lead paste deposition process development for Active Copper.

You will mentor the Wilmington team, partner with R&D Innovation in San Jose, and coordinate with PCB & IC Substrate experts to ensure scalable, defect-free deposition suitable for high-volume manufacturing. Responsibilities include experimental design, data analysis, and presenting technical results to internal and external partners.