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Inabia Software & Consulting Inc. in Irvine, CA seeks a Lead Application Engineer to drive circuit board encapsulant applications and support global customers. You will interface with customers, field teams, and R&D to translate requirements into robust solutions.
The role requires 7+ years in engineering, in-depth SMT and encapsulant experience, and travel up to 25%. This is a full-time, on-site position with relocation assistance for ideal candidates.
Location: Irvine, California
Employment Type: Full-Time
Industry: Manufacturing & Production
Job Category: Engineering — Industrial / Manufacturing
Experience: 7+ years
Education: Bachelor’s or Master’s degree
Travel: Up to 25% globally
Visa Sponsorship: Not available
Security Clearance: Not required
Relocation Assistance: Possible for an ideal candidate
Salary: $108,000- $140,000
Our client is a global technology and manufacturing organization focused on innovation, sustainability, and collaboration. The company develops advanced solutions used across a wide range of industries and serves customers worldwide through a portfolio of trusted brands and cutting-edge technologies.
The position is part of the organization’s Adhesive Technologies business unit, which develops adhesives, sealants, and functional coatings that help customers improve product performance, manufacturing processes, and competitive advantage. The team works closely with customers and internal technical experts to develop innovative solutions for complex manufacturing applications.
The Lead Application Engineer is a strategic technical role supporting circuit board encapsulant application development and customer field-service needs.
The position serves as a key connection between customers, field teams, and laboratory/application engineering personnel. The successful candidate will translate customer requirements into technical solutions, support new application development, optimize material and assembly processes, and troubleshoot product and process-related challenges.
Approximately 50% of the role will involve collaboration with Lab/Application Engineering teams , while the remaining 50% will involve direct customer-facing technical support.
The ideal candidate will be a technically strong Application Engineer or R&D Engineer with hands-on experience in electronics manufacturing, circuit board encapsulation, SMT, materials application, and customer technical support.
Strong customer-facing communication skills are essential, as this position requires the ability to understand complex customer challenges and translate them into practical technical solutions. The candidate should also be comfortable working with global teams and traveling internationally to support customers.