Lead Analog & Mixed-Signal IC Design Engineer

Acceler8 Talent; Massachusetts; On-site; USD 198,000 - 242,000; Full time

Job summary

Acceler8 Talent is recruiting an Analog & Mixed-Signal IC Design Engineer for a Boston onsite role. You will own analog and mixed-signal circuits from architecture to tape-out, including silicon bring-up and characterization, and collaborate across circuit, package and system boundaries to resolve integration trade-offs.

You will work with RF, power, packaging and systems engineers on a heterogeneous multi-material platform, with early ownership and broad responsibilities in a founding-stage

Qualifications

• Delivered analog or mixed-signal silicon with ownership of circuits and development.
• Strong circuit-design fundamentals and ability to explain architecture choices and measured results.
• Practical experience taking designs through tape-out and learning from fabricated hardware.
• Ability to understand packaging and system effects on circuit performance.
• Hands-on work experience in an early-stage team; adaptability and broad responsibility.
• Curiosity about heterogeneous integration and multi-material platforms.

Responsibilities

• Own analog and mixed-signal circuits from architecture through verification and tape-out.
• Lead silicon bring-up, characterization and debug, translating measurements into design decisions.
• Collaborate across circuit, package and system boundaries to optimize integration.
• Partner with RF, power, packaging and systems engineers on a heterogeneous platform.
• Help establish design reviews, verification methods and engineering practices as the team grows.

Skills

Analog circuit design

Mixed-signal design

Tape-out experience

Circuit verification

Characterization

Hardware debugging

Cross-functional collaboration

Job description

Acceler8 Talent is recruiting an Analog & Mixed-Signal IC Design Engineer for a Boston onsite role. You will own analog and mixed-signal circuits from architecture to tape-out, including silicon bring-up and characterization, and collaborate across circuit, package and system boundaries to resolve integration trade-offs.

You will work with RF, power, packaging and systems engineers on a heterogeneous multi-material platform, with early ownership and broad responsibilities in a founding-stage