Internship – Package & Process Engineer

Infineon Technologies AG; Leominster (MA); On-site; USD 65,000 - 90,000; Full time

Job summary

Infineon Technologies AG in the United States is seeking a junior to senior undergraduate/graduate student for hands-on experiences in package design and high-reliability packaging development. You will assist with CAD modeling, 3D design, and collaboration with cross-functional teams to drive packaging solutions.

The role emphasizes safety compliance, problem solving, and effective communication of technical insights.

Qualifications

• Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related field; must be a junior or higher.
• Familiarity with CAD software (SolidWorks, AutoCAD) and 3D modeling tools.
• Basic understanding of material properties for HiRel environments.
• Strong verbal and written communication to convey technical insights.

Responsibilities

• Assist with the design and development of HiRel application packages.
• Support process development activities to ensure robust manufacturing workflows.
• Understand and ensure compliance with quality standards in packaging development.
• Utilize CAD software and 3D modeling tools to create packaging solutions.
• Work with cross-functional teams to drive packaging activities and achieve project goals.
• Ensure all safety requirements and protocols are followed during project execution.
• Participate in team meetings and contribute insights to technical discussions.

Skills

CAD Modeling

3D Modeling

Materials Knowledge

Problem-Solving

Communication Skills

Team Collaboration

Education

Bachelor's or Master's in Mechanical Engineering, Materials Science, Chemical Engineering

Tools

SolidWorks

AutoCAD

Job description

Package Design

Assist with the design and development of HiRel application packages

Process Development

Support process development activities to ensure robust manufacturing workflows

Quality Standards

Understand and ensure compliance with quality standards in packaging development

CAD Modeling

Utilize CAD software and 3D modeling tools to create packaging solutions

Collaboration

Work with cross-functional teams to drive packaging activities and achieve project goals

Safety Compliance

Ensure all safety requirements and protocols are followed during project execution

Technical Discussions

Participate in team meetings and contribute insights to technical discussions

Education

Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related field; must be a junior or higher

Technical Expertise

Familiarity with CAD software (e.g., SolidWorks, AutoCAD, or similar) and 3D modeling tools

Materials Knowledge

Basic understanding of material properties and selection, especially those used in high-reliability (HiRel) environments

Problem-Solving Skills

Ability to analyze problems, troubleshoot, and contribute to process improvements

Communication Skills

Strong verbal and written communication skills to convey technical insights effectively

US nationality requirement

US citizen or green card holder: This position requires access to documentation that is controlled by the export laws of the United States

Company Commitment

We are on a journey to create the best Infineon for everyone. We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity. Our hiring decisions are based on skills and experience. Even if you don't meet every requirement, we encourage you to apply. Please let your recruiter know if you need any accommodations during the interview process. Learn more about our various contact channels and about Diversity & Inclusion at Infineon