HiRel Package Design & Process Intern

Infineon Technologies AG

Leominster (MA)

On-site

USD 65,000 - 90,000

Full time

3 days ago

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Job summary

Infineon Technologies AG in the United States is seeking a junior to senior undergraduate/graduate student for hands-on experiences in package design and high-reliability packaging development. You will assist with CAD modeling, 3D design, and collaboration with cross-functional teams to drive packaging solutions.

The role emphasizes safety compliance, problem solving, and effective communication of technical insights.

Qualifications

Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related field; must be a junior or higher.
Familiarity with CAD software (SolidWorks, AutoCAD) and 3D modeling tools.
Basic understanding of material properties for HiRel environments.
Strong verbal and written communication to convey technical insights.

Responsibilities

Assist with the design and development of HiRel application packages.
Support process development activities to ensure robust manufacturing workflows.
Understand and ensure compliance with quality standards in packaging development.
Utilize CAD software and 3D modeling tools to create packaging solutions.
Work with cross-functional teams to drive packaging activities and achieve project goals.
Ensure all safety requirements and protocols are followed during project execution.
Participate in team meetings and contribute insights to technical discussions.