Infrared Sensor Wire Bonding Technician

Teledyne Technologies Incorporated; Camarillo (CA); On-site; USD 45,000 - 59,000; Full time

Benefits offered by this job

Competitive Salary

Health, Dental, Vision, Life Insurance

Paid Vacation, Sick Time, Holidays

401(k) with Company Match

Employee Stock Purchase Plan

Educational Tuition Reimbursement

Fun Employee Events

Job summary

Teledyne Imaging Sensors in Camarillo, CA is seeking a Wire Bonding Technician to join a mission‑focused team that values technical excellence, collaboration, and agility. You will perform wire bonding of Focal Plane Arrays and silicon readout devices and inspect parts to meet Quality Assurance requirements.

Candidates need experience with manual ball and wedge bonding and automatic bonders, the ability to work under a microscope, and familiarity with ESD controls.

Qualifications

• Experience with manual ball and wedge bonding and automatic wire bonders.
• Ability to work under a microscope with steady hand-eye coordination.
• Familiarity with electrostatic discharge (ESD) controls.
• High School Diploma with 3–5 years experience, or Associate degree with 0–2 years.
• U.S. Citizenship required.

Responsibilities

• Perform wire bonding of Focal Plane Arrays (FPA) and silicon readout devices.
• Inspect and evaluate parts per Quality Assurance requirements.
• Follow established procedures and bonding diagrams.
• Frequently work with ERP system for tracking and reporting of data.

Skills

Wire bonding

Microscope work

ESD controls

ERP data entry

Education

High School Diploma

Associate degree

Tools

Manual ball bonding

Wedge bonding

Automatic wire bonders

Job description

Teledyne Imaging Sensors in Camarillo, CA is seeking a Wire Bonding Technician to join a mission‑focused team that values technical excellence, collaboration, and agility. You will perform wire bonding of Focal Plane Arrays and silicon readout devices and inspect parts to meet Quality Assurance requirements.

Candidates need experience with manual ball and wedge bonding and automatic bonders, the ability to work under a microscope, and familiarity with ESD controls.