Infrared FPA Packaging Engineer | Mechanical & Assembly

SAAZ Micro Inc.; Camarillo (CA); On-site; USD 70,000 - 110,000; Full time

Job summary

SAAZ Micro Inc. in Camarillo, CA seeks a hands-on Mechanical Engineer to design, assemble and package infrared focal plane arrays for visible and infrared sensors.

You will work across mechanical and electrical subsystems, develop assembly processes and support testing. The role requires experience in lab or manufacturing environments with FPAs, familiarity with optoelectronic packaging, and proficiency in CAD tools such as AutoCAD or SolidWorks.

Qualifications

• Experience in a lab or manufacturing environment involving assembly, integration, test and troubleshooting of visible and IR cameras and FPAs.
• Experience with optoelectronic packaging technology and integration techniques.
• Ability to follow formal and informal assembly and integration processes.
• Proficiency with Microsoft Office tools (Word, Excel, and PowerPoint) and ability to create charts and communicate clearly.
• Experience with AutoCAD design, SolidWorks or other design software.

Responsibilities

• Integrate mechanical and electrical subsystems into a larger system.
• Develop assembly processes and yield improvement activities.
• Assemble FPAs into final device packaging including die attach, wire bonding, solder, inspect and test.
• Perform hands-on work on mechanical and electrical systems and components.
• Set up and operate test equipment to verify, evaluate, and troubleshoot systems and components.
• Read, understand and utilize engineering documentation including drawings, assembly/process instructions, block diagrams, schematic diagrams, and bills of material.

Skills

Mechanical aptitude

Strong communication

Time management

Documentation

Problem solving

Tools

AutoCAD

SolidWorks

Excel

Job description

SAAZ Micro Inc. in Camarillo, CA seeks a hands-on Mechanical Engineer to design, assemble and package infrared focal plane arrays for visible and infrared sensors.

You will work across mechanical and electrical subsystems, develop assembly processes and support testing. The role requires experience in lab or manufacturing environments with FPAs, familiarity with optoelectronic packaging, and proficiency in CAD tools such as AutoCAD or SolidWorks.