Focal Plane Process Engineer - Infrared Detectors & Bonding

Raytheon; Goleta (CA); On-site; USD 76,000 - 144,000; Full time

Job summary

Raytheon Vision Systems in Goleta is seeking a Focal Plane Process Engineer with a background in Semiconductor Fabrication to support and maintain infrared focal plane manufacturing. You will develop and maintain alignment, assembly, and machining processes for semiconductor chip stacks used in infrared focal plane arrays.

The role requires breadth across Mechanical Engineering, Semiconductor Process Engineering, and Materials Science, with experience in flip chip bonding and precision

Qualifications

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 2 years of prior relevant experience.
• Experience as Process or Manufacturing Engineer in a production environment.

Responsibilities

• Managing process development and improvement projects, including novel processing techniques, yield increase, throughput, and safety improvements
• Reviewing material in WIP, certifying operators, dispositioning out of flow material, and hands on processing of novel detector designs
• Providing Process Ownership of flip chip bonding, diamond point turning, precision alignment, or optical coatings
• Developing requirements and qualification plans for new equipment procurements
• Work in a cleanroom environment with full coverall garments

Skills

STEM degree

Process/Manufacturing Engineer

Optics / Electro-Optics

Focal Plane Array knowledge

Communication skills

Education

Bachelor's degree in Science/Engineering/Mathematics (STEM)

Tools

MATLAB

Python

Job description

Raytheon Vision Systems in Goleta is seeking a Focal Plane Process Engineer with a background in Semiconductor Fabrication to support and maintain infrared focal plane manufacturing. You will develop and maintain alignment, assembly, and machining processes for semiconductor chip stacks used in infrared focal plane arrays.

The role requires breadth across Mechanical Engineering, Semiconductor Process Engineering, and Materials Science, with experience in flip chip bonding and precision