Implant Equipment Engineer: Elevate Yield & Uptime (On‑Site)

Samsung Semiconductor; Taylor (TX); On-site; USD 70,000 - 179,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Retirement plan

Onsite facilities

Job summary

Samsung Austin Semiconductor is seeking an Implant Engineer to support 300mm implant equipment and process capabilities in Taylor, Texas. You will drive yield improvements, reduce defects, and optimize operating costs while implementing continuous improvements in a 24/7 manufacturing setting.

The role requires leading equipment installations, maintaining uptime, updating SOPs, and collaborating with major vendors to resolve technical issues and support process interactions across the implant

Qualifications

• 4+ years of industry experience as a tool owner in Implant.
• Excellent troubleshooting skills using data and structured problem solving.
• Strong communication and collaboration skills.
• Experience with wafer fabrication implants and understanding failure modes.

Responsibilities

• Lead installation to qualify Implant equipment for production readiness and timelines.
• Maintain equipment uptime through real-time issue resolution and continuous improvements.
• Revise SOPs, document tool activity, generate gameplans and capture lessons learned.

Skills

Implant experience

Troubleshooting

Communication & collaboration

Education

B.S./M.S. in Electrical, Chemical, or Mechanical Engineering or related field

Tools

AMAT equipment

Nissin equipment

Axcelis equipment

Job description

Samsung Austin Semiconductor is seeking an Implant Engineer to support 300mm implant equipment and process capabilities in Taylor, Texas. You will drive yield improvements, reduce defects, and optimize operating costs while implementing continuous improvements in a 24/7 manufacturing setting.

The role requires leading equipment installations, maintaining uptime, updating SOPs, and collaborating with major vendors to resolve technical issues and support process interactions across the implant