Impactful Semiconductor Failure Analysis Engineer

Socket.dev; Phoenix (AZ); On-site; USD 90,000 - 120,000; Full time

Job summary

TSMC Arizona is recruiting a Failure Analysis Engineer to join its world‑class semiconductor manufacturing team in Phoenix. You will perform advanced materials analysis using TEM, FIB, SEM, SIMS, and XPS, support fab operations, and participate in on‑call responses to address urgent needs.

Collaboration with customers and stakeholders will drive actionable feedback and process improvements.

Qualifications

• Master's degree in Materials Science, Physics, or a related field.
• At least 1 year of laboratory experience, preferably in support of Semiconductors R&D or High-Volume Manufacturing (HVM).
• Proficient in at least one lab technique: TEM, FIB, SEM, SIMS, XPS, or AES.

Responsibilities

• Support fab manufacturing operations and participate in on-call schedule.
• Collaborate with customers and factory stakeholders to interpret requests and provide feedback.
• Perform advanced materials analysis using TEM, FIB, SEM, SIMS, and XPS for semiconductor manufacturing.
• Troubleshoot and resolve lab equipment issues to minimize downtime.
• Develop and improve analytical methods to enhance lab efficiency.
• Assist and train technicians in resolving tool and process challenges.

Skills

Lab techniques

Independent working

Communication

Education

Master’s degree in Materials Science, Physics, or related field

Tools

TEM

FIB

SEM

SIMS

XPS

AES

Job description

TSMC Arizona is recruiting a Failure Analysis Engineer to join its world‑class semiconductor manufacturing team in Phoenix. You will perform advanced materials analysis using TEM, FIB, SEM, SIMS, and XPS, support fab operations, and participate in on‑call responses to address urgent needs.

Collaboration with customers and stakeholders will drive actionable feedback and process improvements.