Failure Analysis Technician F21

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Phoenix (AZ); On-site; USD 60,000 - 80,000; Full time

Job summary

TSMC - Taiwan Semiconductor Manufacturing Company Limited in Phoenix, Arizona is seeking a Failure Analysis Technician to join our team. The role involves chip failure analysis, utilizing advanced tools like FIB, SEM, and C-AFM, and ensuring quality and yield of wafers.

The ideal candidate will have relevant experience in TEM sample preparation, be able to work independently or as part of a team, and manage tasks effectively in a fast-paced environment. This position may require night shifts and working in a clean room.

Qualifications

• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) is preferred.
• Able to handle pressure in a fast-paced working environment.
• Basic PC skills (MS Windows OS and MS Office) are required.

Responsibilities

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis.
• Collecting and organizing data, and reporting to engineers.
• Maintaining laboratory housekeeping (6S) environment and protocols.

Skills

Chip failure analysis

Analytical method development

Laboratory housekeeping (6S)

TEM analysis (HR-STEM imaging, EDS)

Education

Associate degree or Bachelor's degree at a Science/Engineering/Technology school

Tools

FIB, SEM, C-AFM, nano-probe tools

MS Windows OS

MS Office

Job description

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for a Failure Analysis Technician to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Failure Analysis Technician, you will demonstrate a strong sense of chip failure analysis and possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona’s Product Failure Analysis is responsible for chip failure analysis to reinforce our process robustness and ensure high yield and quality of the wafers.

Job Description

Responsibilities

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting
• TEM sample preparation will also include sample pre-treatment such as site marking, de-layering, and other necessary steps.
• Chemicals handling in a safe manner with PPE is required.
• Collecting and organizing data, and reporting to engineers
• Assisting engineers with analytical method development.
• Maintaining laboratory housekeeping (6S) environment and protocols.
• Supporting Fab manufacturing operations and being part of our teams’ on-call schedule.

Minimum Qualifications

Applicants must be legally eligible to work in the United States and have:

• Associate degree (A.A.S.) or Bachelors degree at a Science/Engineering/Technology school or the equivalent education is preferred but not required.
• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) is preferred but not required.
• TEM analysis experience/skill in HR-STEM imaging and EDS analysis is preferred but not required.
• Able to work independently and prioritize your tasks on-hand to meet deadlines.
• Must be a team player and have a positive attitude and strong work ethic.
• Be able to handle pressure in a fast-paced working environment.
• Be able to work night and weekend shifts when assigned, and work overtime if needed.
• May be required to work in a clean room environment (Near-line FIB/TEM).
• Basic PC skills (MS Windows OS and MS Office) are required.