Image Sensor: Mixed-Signal IC Design Engineer II

Raytheon; Goleta (CA); On-site; USD 75,800 - 144,200; Full time

Benefits offered by this job

Relocation assistance available

Job summary

Raytheon Vision Systems is seeking a talented Mixed Signal Design Engineer II to join our design team in Goleta, CA. You will collaborate in a fast-paced environment to develop cutting-edge ROICs for visible and infrared sensors, participating in ASIC/ROIC development across architecture, design, verification, and fabrication stages.

You will work on analog/digital signal chains, timing, low‑power ADCs, and cross‑functional teams ensuring high‑quality image sensor products from concept to

Qualifications

• Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) with a minimum of 2 years of prior relevant experience or an Advanced Degree in a related field.
• Experience or coursework in CMOS IC design at transistor level using IC design flows and tools.
• Experience with CAD tools such as Cadence and Mentor Graphics (Siemens), with analysis and programming tools such as MATLAB, and with programming or scripting languages such as Python.

Responsibilities

• Design, development, and verification of read-out ICs (ROICs) for visible and infrared focal plane arrays.
• Evaluate flow from design to synthesis, place and route, timing and power use.
• Determine architecture and module interfaces for simulation; design mixed-signal ICs for image sensors with 12–14 bit on‑chip ADCs.

Skills

CMOS IC design

CAD tools

MATLAB

Python

Education

Bachelor's degree in STEM

Advanced degree in related field

Tools

Cadence

Mentor Graphics

Job description

Raytheon Vision Systems is seeking a talented Mixed Signal Design Engineer II to join our design team in Goleta, CA. You will collaborate in a fast-paced environment to develop cutting-edge ROICs for visible and infrared sensors, participating in ASIC/ROIC development across architecture, design, verification, and fabrication stages.

You will work on analog/digital signal chains, timing, low‑power ADCs, and cross‑functional teams ensuring high‑quality image sensor products from concept to