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NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.
The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.
NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.
The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.