IC Packaging Design Engineer — EM Modeling & NPI Impact

NXP Semiconductors NV

Chandler (AZ)

On-site

USD 120,000 - 170,000

Full time

2 days ago
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Job summary

NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.

The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.

Qualifications

  • MSEE+ with experiences in microelectronics packaging design and EM modeling.
  • Experience with EM modeling and simulation tools is preferred.
  • RF design experience and high-frequency modeling beneficial.
  • Knowledge of IO interfaces (LVDS, DDR, SerDes) desirable.
  • Team-oriented with strong communication and collaboration skills.

Responsibilities

  • Provide optimized package design solutions for New Product Introductions (NPI) and NTI.
  • Define packages meeting electrical performance, manufacturability, and cost targets.
  • Run EM modeling to verify package performance and document results.
  • Collaborate with SoC and PCB teams to optimize package solutions.
  • Deliver package electrical data or models to BL for system-level sims.
  • Support layout optimization with electrical data to improve IO and power.

Skills

MSEE+
EM modeling
RF design
PCB interface understanding

Education

MSEE+ with microelectronics packaging focus

Tools

HFSS
Q3D
AWR
CST Microwave Studio
Keysight EMPro
ADS
Cadence SI Tools

Job description

NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.

The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.

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