Package Design Electrical Engineer

NXP Semiconductors NV; Chandler (AZ); On-site; USD 120,000 - 170,000; Full time

Job summary

NXP Semiconductors NV in Chandler, AZ, seeks an experienced RF packaging engineer to design optimized package solutions for new products. You will model EM behavior, drive electrical performance, and collaborate with SoC/PCB teams to enhance IO and power delivery across packaging designs.

The role requires a strong background in microelectronics packaging, RF modeling, and relevant tool proficiency. This position is on-site in Chandler with competitive compensation and benefits.

Qualifications

• MSEE+ with experiences in microelectronics packaging design and EM modeling.
• Experience with EM modeling and simulation tools is preferred.
• RF design experience and high-frequency modeling beneficial.
• Knowledge of IO interfaces (LVDS, DDR, SerDes) desirable.
• Team-oriented with strong communication and collaboration skills.

Responsibilities

• Provide optimized package design solutions for New Product Introductions (NPI) and NTI.
• Define packages meeting electrical performance, manufacturability, and cost targets.
• Run EM modeling to verify package performance and document results.
• Collaborate with SoC and PCB teams to optimize package solutions.
• Deliver package electrical data or models to BL for system-level sims.
• Support layout optimization with electrical data to improve IO and power.

Skills

MSEE+

EM modeling

RF design

PCB interface understanding

Education

MSEE+ with microelectronics packaging focus

Tools

HFSS

Q3D

AWR

CST Microwave Studio

Keysight EMPro

ADS

Cadence SI Tools

Job description

Business Unit Description

NXP's Technology organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive technologies, and supply to create a competitive advantage for our customers.

Business Unit Description

NXP's Technology organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive technologies, and supply to create a competitive advantage for our customers.

Package Innovation delivers IC packaging solutions and new packaging technology for all NXP products. Within Package Innovation, the Package Design Electrical team provides package design solutions for Business Lines (BL) including Advanced Analog, Radio Frequency Processing, Edge Processing, Automotive Processing, and Connectivity & Security. The working frequency of our package solutions can vary from DC (PMIC) to 100GHz plus (Radar or 6G). Package complexity varies from several pins to thousands of IOs.

Primary Responsibilities

• Responsible for providing optimized package design solutions for New Product and New Technology Introductions (NPI, NTI).
• Define packages that meet product requirements for electrical performance, manufacturability, and cost.
• Run Electromagnetic (EM) modeling tools to ensure package performance and document modeling results.
• Work with business line System on Chip (SoC) and Printed Circuit Board (PCB) teams to optimize the performance of package solutions.
• Provide electrical design rules to Package Design Layout (PDL) team and work with PDL to optimize the package layout using electrical modeling data to improve IO interface and power performance.
• Provide package electrical data or models to BL team for system level simulation.

Job Qualifications

• MSEE+ with experiences in microelectronics packaging design and EM modeling or related field required.
• EM educational background, proficient on EM modeling and simulation tools (HFSS, Q3D, AWR, CST Microwave Studio, Keysight EMPro, ADS, Cadence Signal and power integrity tools) is strongly preferred.
• Radio Frequency (RF) design experience, RF and multiple GHz wired & wireless modeling experience, and antenna modeling experience are preferred.
• Understand electrical design of various IO interfaces (e. g. LVDS, DDR, SerDes) used in semiconductor industry.
• PCB design experience or worked with PCB designer is preferred.
• Knowledge on die level Back End of Line (BEOL) design is a plus.
• Team player with positive attitude, self-driven proactive mindset, and innovative outlook.
• Excellent written and verbal communication and presentation skills are required.
• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.