IC Package Design Engineer

Apple; Santa Clara (CA); On-site; USD 175,000 - 313,000; Full time

Job summary

An innovative industry leader is seeking a skilled IC Package Design Engineer to join their dynamic Hardware Technology Packaging team. In this pivotal role, you will leverage your extensive experience to design and optimize electronic packaging solutions for cutting-edge consumer electronics. Your expertise will drive the physical design of packages for SoC, Memory, RF, and cellular chips, while collaborating with multi-functional teams to ensure exceptional mechanical, electrical, and thermal performance. This is an exciting opportunity to contribute to the development of groundbreaking products that shape the future of technology. Join a company that values passion, excellence, and innovation, and be part of a team that is dedicated to creating extraordinary experiences for customers.

Benefits

Comprehensive medical and dental coverage

Retirement benefits

Employee stock purchase plan

Tuition reimbursement

Discounted products and services

Discretionary bonuses

Qualifications

• 10+ years of relevant industry experience in package design.
• Strong understanding of electrical, thermal, and mechanical engineering principles.

Responsibilities

• Implement physical design of packages for various chips.
• Coordinate with multi-functional groups on package feasibility and selection.
• Drive innovations and efficiency improvements in package design.

Skills

Electrical Engineering

Thermal Engineering

Mechanical Engineering

Package Design

Scripting Languages (PERL, Python, TCL)

High-Speed Interfaces (DDR, PCIe, NAND)

Education

Bachelor's Degree

Tools

Cadence Allegro

Mentor Xpedition

SI/PI Tools (XtractIM, PowerSI, HFSS, Q3D)

Job description

IC Package Design Engineer

Santa Clara, California, United States Hardware

Summary

Posted: Mar 13, 2025

Role Number: 200575144

Do you have the attention for details and love for excellence to work towards an extraordinary result? Envision what you could do here! At Apple, we believe new insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish! Our Hardware Technology Packaging team invents, designs, develops and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV, etc. In this highly visible role, you will own and drive sophisticated package selection, new generation product package structure and configuration optimization. You will be responsible for Package/SIP/module physical design and layout, optimization, DV and tape out; and work with multi-functional teams to achieve optimized mechanical/electrical/ thermal performance for various types of chips.

Description

1. Implement the physical design of packages and modules for SoC, Memory, RF and cellular chips.
2. Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection.
3. Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows.
4. Work multi-functionally to optimize package pin out.
5. Perform extraction of S-parameters and package RLGC model.
6. Ensure package design is optimized with SI/PI requirements.
7. Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
8. Explore, evaluate and develop new CAD tool, design and verification flow.
9. Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size.

Minimum Qualifications

+ BS and 10+ years of relevant industry experience.

Preferred Qualifications

1. As the IC Package Design Engineer, you demonstrate fundamental knowledge or proven experience in the following:
2. Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s).
3. Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.).
4. Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.
5. Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.
6. Basic knowledge of substrate manufacturing process, structure, design rules and material property.
7. Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc.
8. Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology.

Pay & Benefits

At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $175,800 and $312,200, and your base pay will depend on your skills, qualifications, experience, and location.

Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation.

Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.