IC Package Design Engineer

Anysilicon; Los Angeles (CA); Híbrido; USD 120 000 - 160 000; Tempo integral

Resumo da oferta

Apple is seeking a Package Design Engineer to define, design, and integrate advanced electronic packaging solutions for devices such as iPhone, iPad, Mac, Apple Watch, and Apple TV. You will shape the architecture and physical integration of semiconductor packages across technologies, leveraging automation and AI to boost efficiency.

You will own the physical design from concept through tape-out, perform layout for SoCs, memory, RF, and cellular ICs, and collaborate across product design and

Qualificações

• Bachelor's degree required.
• Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms.
• Strong understanding of high-speed interface layout constraints and SI/PI analysis, with experience in simulation tools like HFSS or PowerSI.
• Solid grasp of substrate manufacturing processes, design rules, and design for manufacturability.
• Familiarity with Unix/Linux environments and proficiency in scripting languages such as Python, Perl, or TCL.

Responsabilidades

• Lead advanced package architecture and optimization of package structures.
• Own the physical design of Package/SiP/module from concept through tape-out.
• Perform physical layout of package substrates for diverse silicon technologies including SoC, Memory, RF, and cellular ICs.
• Execute parasitic extraction and S-parameter modeling to ensure SI/PI performance targets are met.
• Collaborate with cross-functional teams on package feasibility and system co-optimization, aligning with Product Design and Silicon/SIPI teams.
• Drive improvements in package design methodology by evaluating new CAD tools and developing automated design and verification flows.

Conhecimentos

High-speed interface design

SiP/package integration

Unix/Linux environments

Scripting (Python, Perl, TCL)

Formação académica

Bachelor's degree

Ferramentas

Cadence Allegro

Mentor Xpedition

HFSS

PowerSI

Python

Perl

TCL

Descrição da oferta de emprego

Join Apple's Packaging team as a Package Design Engineer, where you will define, design, and integrate advanced electronic packaging solutions for products like iPhone, iPad, Mac, Apple Watch, and Apple TV. This role focuses on driving the physical design and integration of semiconductor packages across various technologies, shaping the architecture and efficiency of next-generation products while leveraging automation and AI.

Responsibilities:

• Lead advanced package architecture and optimization of package structures.
• Own the physical design of Package/SiP/module from concept through tape-out.
• Perform physical layout of package substrates for diverse silicon technologies including SoC, Memory, RF, and cellular ICs.
• Execute parasitic extraction and S-parameter modeling to ensure SI/PI performance targets are met.
• Collaborate with cross-functional teams on package feasibility and system co-optimization, aligning with Product Design and Silicon/SIPI teams.
• Drive improvements in package design methodology by evaluating new CAD tools and developing automated design and verification flows.

Qualifications:

• Bachelor's degree required.
• Proven experience in IC package physical design using Cadence Allegro or Mentor Xpedition platforms.
• Strong understanding of high-speed interface layout constraints and SI/PI analysis, with experience in simulation tools like HFSS or PowerSI.
• Solid grasp of substrate manufacturing processes, design rules, and design for manufacturability.
• Familiarity with Unix/Linux environments and proficiency in scripting languages such as Python, Perl, or TCL.