Senior System IC Architect – PoL Power & SiP for AI Compute

NXP Semiconductors; Austin (TX); On-site; USD 180,000 - 290,000; Full time

Job summary

NXP Semiconductors in Austin seeks a visionary System IC Architect with deep expertise in system-level architecture, high-performance power management, and packaging technologies. You will define PoL solutions, shape architecture strategy, and drive AI compute and automotive 48V initiatives with SiP integration.

You will partner with R&D and product teams to translate customer needs into innovative power modules, lead cross-functional efforts, and advance thermal and electrical analysis to

Qualifications

• Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred).
• 15+ years of experience in power semiconductors, packaging, and system-level integration.
• Expertise in System-in-Package (SiP) integration.
• Experience in AI compute power and automotive power management.

Responsibilities

• Define product concepts and specifications for power semiconductor modules and SiP solutions.
• Develop and maintain long-term roadmaps with R&D and product line leaders.
• Translate customer requirements into packaging and power management solutions.
• Provide strategic insights on state-of-the-art power management technologies.

Skills

System architecture

Power electronics

Thermal management

AI compute power

Automotive power

Cross-functional leadership

PCB materials

Education

Master's degree in Power Electronics (PhD preferred)

Tools

Cadence Spectre

PSPICE

HSPICE

Saber

Verilog-AMS

Simetrix/Simplis

Job description

NXP Semiconductors in Austin seeks a visionary System IC Architect with deep expertise in system-level architecture, high-performance power management, and packaging technologies. You will define PoL solutions, shape architecture strategy, and drive AI compute and automotive 48V initiatives with SiP integration.

You will partner with R&D and product teams to translate customer needs into innovative power modules, lead cross-functional efforts, and advance thermal and electrical analysis to