Head of Analog/Mixed-Signal IC Design & Wearables

Ixana; West Lafayette (IN); On-site; USD 180,000 - 250,000; Full time

Benefits offered by this job

Relocation assistance

Visa sponsorship

Medical, dental, vision

Generous PTO

Early-stage equity

Job summary

Ixana in West Lafayette, Indiana seeks a senior IC design leader to drive a world-class analog, mixed-signal, RF, and digital team. You will own the end-to-end chip lifecycle from spec to tapeout and production, setting architectural direction and ensuring high-yield results.

You will mentor engineers, collaborate with hardware, firmware, and product teams, engage with vendors and EDA tools, and shape the company’s technology strategy as it ships globally.

Qualifications

• 10-20 years of experience in analog and mixed-signal IC design.
• Leadership in taking chips from first spec to high-yield production.
• Deep expertise in design for low-power, wireless, or wearable applications.
• Experience leading and scaling high-performance engineering teams.
• Strategic thinker with a hands-on approach to solving engineering challenges.

Responsibilities

• Lead and grow a world-class IC design team across analog, mixed-signal, RF, and digital domains.
• Own the end-to-end chip lifecycle—from concept to GDSII to bring-up and production.
• Set architectural direction and technical standards across IC design projects.
• Work cross-functionally with hardware, firmware, and product teams to translate chip performance into real-world applications.
• Guide vendor/EDA tool engagement, IP integration, and tapeout execution.
• Hire, mentor, and retain exceptional engineering talent.
• Represent engineering in executive strategy discussions and technical partnerships.

Skills

IC design leadership

Analog/mixed-signal

Low-power design

Wireless wearables

Team leadership

Cross-functional

Strategic thinking

Job description

Ixana in West Lafayette, Indiana seeks a senior IC design leader to drive a world-class analog, mixed-signal, RF, and digital team. You will own the end-to-end chip lifecycle from spec to tapeout and production, setting architectural direction and ensuring high-yield results.

You will mentor engineers, collaborate with hardware, firmware, and product teams, engage with vendors and EDA tools, and shape the company’s technology strategy as it ships globally.