VP Engineering, IC Design

Ixana; West Lafayette (IN); On-site; USD 180,000 - 250,000; Full time

Benefits offered by this job

Relocation assistance

Visa sponsorship

Medical, dental, vision

Generous PTO

Early-stage equity

Job summary

Ixana in West Lafayette, Indiana seeks a senior IC design leader to drive a world-class analog, mixed-signal, RF, and digital team. You will own the end-to-end chip lifecycle from spec to tapeout and production, setting architectural direction and ensuring high-yield results.

You will mentor engineers, collaborate with hardware, firmware, and product teams, engage with vendors and EDA tools, and shape the company’s technology strategy as it ships globally.

Qualifications

• 10-20 years of experience in analog and mixed-signal IC design.
• Leadership in taking chips from first spec to high-yield production.
• Deep expertise in design for low-power, wireless, or wearable applications.
• Experience leading and scaling high-performance engineering teams.
• Strategic thinker with a hands-on approach to solving engineering challenges.

Responsibilities

• Lead and grow a world-class IC design team across analog, mixed-signal, RF, and digital domains.
• Own the end-to-end chip lifecycle—from concept to GDSII to bring-up and production.
• Set architectural direction and technical standards across IC design projects.
• Work cross-functionally with hardware, firmware, and product teams to translate chip performance into real-world applications.
• Guide vendor/EDA tool engagement, IP integration, and tapeout execution.
• Hire, mentor, and retain exceptional engineering talent.
• Represent engineering in executive strategy discussions and technical partnerships.

Skills

IC design leadership

Analog/mixed-signal

Low-power design

Wireless wearables

Team leadership

Cross-functional

Strategic thinking

Job description

What You'll Do

• Lead and grow a world-class IC design team across analog, mixed-signal, RF, and digital domains
• Own the end-to-end chip lifecycle-from concept to GDSII to bring-up and production
• Set architectural direction and technical standards across IC design projects
• Work cross-functionally with hardware, firmware, and product teams to translate chip performance into real-world applications
• Guide vendor/EDA tool engagement, IP integration, and tapeout execution
• Hire, mentor, and retain exceptional engineering talent
• Represent engineering in executive strategy discussions and technical partnerships

What We're Looking For

Required:

• 10-20 years of experience in analog and mixed-signal IC design
• Demonstrated leadership in taking chips from first spec to high-yield production
• Deep expertise in design for low-power, wireless, or wearable applications
• Experience leading and scaling high-performance engineering teams
• Strategic thinker with a hands-on approach to solving engineering challenges

Preferred:

• Tapeout experience in startups or product-first environments
• Familiarity with system-level design and integration including firmware/hardware co-design
• Strong communication and stakeholder management skills
• A track record of mentorship and team development

Compensation & Benefits

• Base Salary: $180,000 - $250,000 per annum ≈ $340k - $480k Bay Area equivalent after cost of living
• + Performance bonus + meaningful early-stage equity
• Relocation bonus, partner job-search help
• Full visa sponsorship (STEM-OPT transfer / H-1B / TN / future green card)
• Medical, dental, vision, 401(k), generous PTO, inventor cash awards

Why Join Us

• Work on once-in-a-decade tech: ultra-efficient, body-centric communication
• Lead IC engineering at a company where your designs will ship quickly and globally
• Collaborate with pioneers in wireless, chip, and embedded system design
• Build a legacy team and define a new category of computing

Keywords

Semiconductor, Wi-R, Startup, Analog IC Design, Mixed-Signal Engineering, RF Systems, SoC Architecture, Chip Tapeout, Low-Power Design, Wireless Communication, Engineering Leadership, ASIC Development, Wearable Technology