HBM SoC RTL Design Engineer — High-Performance Memory

Micron Technology, Inc.; Folsom (CA); Presencial; USD 181 000 - 323 000; Tempo integral

Resumo da oferta

Micron Technology, Inc. in Folsom, California, is seeking a hands-on RTL Design Engineer for the Heterogeneous Integration Group to design and integrate RTL for the HBM logic die, collaborating with architecture, verification and physical design teams.

The role focuses on RTL build, IP integration, debugging and pre/post-silicon support, with emphasis on high performance, power efficiency and manufacturability across SoC blocks.

Qualificações

• Bachelor’s or master’s degree in electrical engineering or computer engineering.
• Minimum 10 years of experience in RTL design or a related field.

Responsabilidades

• Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die.
• Integrate internal and third‑party IP (controllers, microcontrollers, NOC, RAS, MBIST, interfaces).
• Collaborate with SoC architects to translate specifications into RTL implementations.
• Participate in SoC‑level integration activities: clocking, reset, power intent, configuration infrastructure.
• Assist with pre‑silicon validation and post‑silicon bring‑up, root‑cause analysis.
• Contribute to design documentation, block specs, and design reviews.

Conhecimentos

SystemVerilog/Verilog

SoC integration methodologies

RTL-to-GDS flow

EDA tools

Scripting (Python, TCL)

Formação académica

Bachelor’s or Master’s degree in Electrical or Computer Engineering

Ferramentas

Cadence

Synopsys

Siemens

Descrição da oferta de emprego

Micron Technology, Inc. in Folsom, California, is seeking a hands-on RTL Design Engineer for the Heterogeneous Integration Group to design and integrate RTL for the HBM logic die, collaborating with architecture, verification and physical design teams.

The role focuses on RTL build, IP integration, debugging and pre/post-silicon support, with emphasis on high performance, power efficiency and manufacturability across SoC blocks.