HBM Memory Design Engineer Intern

Micron; Richardson (TX); On-site; USD 28,000 - 55,000; Full time

Benefits offered by this job

Medical insurance

Dental & Vision plans

Paid time off

Paid holidays

Family leave

Job summary

Micron Technology is seeking an HBM Design Engineer Intern to contribute to RTL development, timing analysis, and AI-assisted design workflows within a collaborative global team. You will gain hands-on experience with semiconductor design methodologies and industry-standard EDA tools while working on memory products for AI and HPC applications.

The role involves cross-functional collaboration with Design Verification, Physical Design, CAD, and Product Engineering teams, and emphasizes

Qualifications

• Pursuing a Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
• Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design or Semiconductor Devices.
• Familiarity with Verilog, SystemVerilog or VHDL; programming in Python, Perl, Tcl, C/C++.

Responsibilities

• Assist with RTL development, circuit implementation, simulation, verification, and functional analysis.
• Develop and use scripting, automation, and AI-assisted workflows to improve design productivity.
• Perform timing, power, and functional analysis of HBM subsystems; support design reviews and investigations.
• Collaborate with Design Verification, Physical Design, CAD, and Product Engineering teams.
• Document technical work, results, build methodologies, and AI-assisted insights.

Skills

Analytical skills

Debugging

Problem solving

Communication

Teamwork

Education

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or Computer Science

Tools

VCS

Xcelium

Questa

PrimeTime

Innovus

Virtuoso

Job description

Micron Technology is seeking an HBM Design Engineer Intern to contribute to RTL development, timing analysis, and AI-assisted design workflows within a collaborative global team. You will gain hands-on experience with semiconductor design methodologies and industry-standard EDA tools while working on memory products for AI and HPC applications.

The role involves cross-functional collaboration with Design Verification, Physical Design, CAD, and Product Engineering teams, and emphasizes